Indium Corporation Experts to Present at South East Asia Technical Conference
Several Indium Corporation technology experts will share their expertise at the Surface Mount Technology Association’s (SMTA) South East Asia Technical Conference on Electronics Assembly April 14-16 in Penang, Malaysia.
Dr. Ning-Cheng Lee, vice president of technology, will give a two-part workshop, DfX for Advanced Soldering Technology. This workshop covers the principles of designing for manufacturability (DfM) and reliability (DfR). Participants will learn how to maximize the output of manufacturing yield and reliability when addressing advanced soldering technology. Dr. Lee’s lessons will include real-world case studies, with fundamental considerations and mechanisms of challenges well illustrated.
Dr. Lee will also present Low Porosity Pressureless Sintering of Novel Nano-Ag Paste for Die-Attach. This presentation reviews the use of a newly developed nano-silver paste, which allows for a pressureless die-attach process that creates sintered joints exhibiting very low porosity, high shear strength, and very good electrical and thermal conductivity.
Sze Pei Lim, technical manager for Southeast Asia, will present Ultralow Residue (ULR) Semiconductor-Grade Fluxes for Copper Pillar Flip-Chip. Because the semiconductor assembly industry has continued to move toward finer pitch, combined with reduced copper pillar height, cleaning processes are becoming increasingly difficult. Lim’s presentation discusses the benefits of using semiconductor-grade, ultra-low residue, no-clean fluxes to address these changes.
Additionally, Dr. Lee and Jonas Sjoberg, technical consultant, will chair the two-part technical session for Cleaning and Conformal Coating.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
Lim manages the company’s technical teams throughout the Asia-Pacific region. Her bachelor’s degree in chemistry is from the National University of Singapore, and she has 17 years of experience in the SMT and PCB assembly industries. Sze Pei is an SMTA-certified process engineer and has earned her Six Sigma Green Belt. She joined Indium Corporation in 2007.
Sjoberg provides technical support to key customers. He has more than 20 years of technical experience in the electronics industry, including deployment of leading-edge technologies for packaging and assembly, launching and managing research and development projects and facilities, and serving as a technical advisor to development and manufacturing sites worldwide.
SMTA is an international network of professionals who build skills, share practical experience, and develop solutions in electronics assembly technologies, including microsystems, emerging technologies, and related business operations.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
Contact:
Anita Brown, Corporate Communications
Indium Corporation
abrown@indium.com
tel: +1.315.381.7524
34 Robinson Road
Clinton, NY 13323 USA
www.indium.com
