IBM Awards Endicott Interconnect Technologies, Inc. Supercomputing Contract
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Endicott Interconnect is Sole Sourced on IBM's Next Generation Program
ENDICOTT, NY- Endicott Interconnect Technologies, Inc. (EI) announced today that
IBM has awarded the Company a contract to supply 100% of the printed circuit boards,
board level assemblies, and full functional test including all of the critical interconnect components for an advanced program.
"EI has a long standing relationship with IBM and we're very pleased to have been
chosen as the key supplier for this state-of-the-art solution. EI is committed to supplying high quality, high reliability and cost efficient products and services to IBM," said Michael J. Hills, Senior VP of Sales, Marketing and Product Management at EI.
About Endicott Interconnect Technologies
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a supplier of electronic interconnect solutions consisting of fabrication and assembly of complex printed circuit boards, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, semiconductor, advanced test equipment, and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.
Company Contact:
Theresa Taro
Director of Marketing and Communications
Phone: (607) 755-1847
Theresa.Taro@eitny.com
1093 Clark Street Endicott, N.Y. 13760 Phone: 866 820-4820 Fax 607 755-7000 www.endicottinterconnect.com
