Henkel Materials Expert to Speak at Upcoming SMTA Meeting
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Well-respected for his leadership in materials science and dedication to the electronics industry, Henkel's Dr. Brian Toleno will speak at the upcoming meeting of the Surface Mount Technology Association's (SMTA) Toronto, Canada Chapter. Speaking on a variety of issues as they relate to underfill technology, Dr. Toleno will share basic information, such as the definition of underfills and their function, as well as more detailed data regarding design rules, reliability and standards.
"We are delighted that Dr. Toleno is speaking to the SMTA's Toronto Chapter," says Bev Christian, VP of Technical Programs for SMTA's Toronto Chapter. "One of the SMTA's charters is continuing education and we are honored that Dr. Toleno will share his vast materials expertise with our members."
In his current role as Application Engineering Team Leader at the electronics group of Henkel, Dr. Toleno is responsible for overseeing applications work for the company's electronic assembly products, including solder paste, liquid flux, conformal coating, potting, surface mount adhesives, board level underfill, and thermally conductive adhesives. He has a B.S. in Chemistry from Ursinus College and received his Ph.D. in analytical chemistry from Penn State University. Prior to joining Henkel, Dr. Toleno managed the failure analysis laboratory at the Electronics Manufacturing Productivity Facility (EMPF). He is an active member of the SMTA, has served as the Program Chair for the 2005 IEMT, and currently serves as the IPC's Underfill Handbook Committee (J-STD-030) chairperson and co-chair of the Solder Paste Standards Committee (J-STD-005). In addition, Dr. Toleno has developed a course on failure analysis for SMTA, has authored numerous technical features for trade journals and peer reviewed publications and has written two chapters for electronic engineering handbooks on adhesives and materials.
Dr. Toleno will speak at the SMTA Toronto Chapter's meeting on January 18, 2006. For more information or to register for this event, please contact Bev Christian by phone at 519-888-7465, extension 2468 or via e-mail at bchristian@rim.com.
About the electronics group of Henkel
Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronic industry.
The Henkel Group, a Fortune Global 500 company, operates in three strategic business areas: Home Care; Personal care; and Adhesives, Sealants and Surface Treatments, which serves the transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offers a broad range of products for the craftsman and consumer. With brands and technologies, Henkel makes people's lives easier, better, and more beautiful. 50,000 employees work for the Henkel Group worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".
Contact
Henkel Corporation
Doug Dixon
Phone:949-789-2500
Fax:949-785-2595
doug.dixon@us.henkel.com
www.electronics.henkel.com
