Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in shadowed out areas. “It is designed to cure in 10-30 seconds at 365nm with 10-40 mW/cm2 of UV output, followed by a post cure at 180°F (~80°C) for 30-60 minutes. This system has been specially designed for applications involving heat sensitive components”, says Rohit Ramnath, Senior Product Engineer. “The product is serviceable from -60°F to 350°F (-51°C to 177°C) and it offers a lower coefficient of thermal expansion 30-35 x 10-6 inch/inch/°C compared to other UV curing systems.”

Master Bond UV22DC80-10F is 100% solids and is not oxygen inhibited. It is capable of curing up to thicknesses of around 0.050 inches. The product can be used for bonding, sealing, coating and glob-top type applications. It has a refractive index of 1.52 at 589 nm. It is available for purchase in 10 cc and 30 cc syringes, ounce jars, ½ pint, 1 pint, and quart containers. The shelf life at 40-50°F is 6 months in the original unopened containers.

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