Dr. Ning-Cheng Lee to Emphasize Reliability at SMT/HYBRID/PACKAGING 2007
Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will lecture on Lead-free electronics assembly with an emphasis on troubleshooting and finished goods reliability at the SMT/HYBRID/PACKAGING Conference in Nuremberg, Germany on April 24-26, 2007.
Dr. Lee's presentation will emphasize implementing reliable lead-free assembly processes by overcoming technical issues and challenges. He will focus on:
o Lead-free legislation status
o Lead-free alloys, surface finishes, components and substrates.
o Lead-free wave soldering, rework, and inspection
o Reliable solutions to common problems in lead-free SMT assembly.
Dr. Lee, a world-renown soldering expert and SMTA Member of Distinction, has extensive experience in the development of solder alloys, solder fluxes, solder pastes, high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information about Indium Corporation visit www.indium.com or email askus@indium.com.
