CEVA Collaborate for Future Wireless Baseband Technologies with NEC CASIO Mobile Communications
BARCELONA, Spain, Feb. 14, 2011 -- Mobile World Congress -- CEVA, Inc. (Nasdaq: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, has announced today an agreement to undertake joint research into the development of cellular modem technologies targeting next generation wireless baseband standards with NEC CASIO Mobile Communications, Ltd. Under the scope of the agreement, CEVA and NEC CASIO Mobile Communications will closely analyze the processing requirements, target performance and system layout of next generation modems.
Wireless baseband technologies are evolving fast through multiple 3G and 4G standards including: HSPA+, WiMAX and LTE. Next generation wireless modems are required to address the dramatically growing complexity in multiple aspects, including: download and upload peak data rates, antenna scheme, spatial multiplexing, synchronization, and more.
"CEVA is honored to collaborate with NEC CASIO Mobile Communications for future wireless baseband technologies," said Gideon Wertheizer, CEO of CEVA. "As the world's number one DSP architecture deployed in wireless baseband processors, we have an innate understanding of how to successfully address the growing complexity of modem processing and deliver industry-leading solutions."
With seven of the world's top eight handset OEMs shipping CEVA-powered baseband processors today, CEVA's DSP technology powers one out of every three handsets worldwide. Addressing next-generation 4G terminal and infrastructure markets, CEVA's latest generation DSP, the CEVA-XC has been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance Software Defined Radio multimode solutions. It supports multiple air interfaces in software, including LTE-A, LTE, TD-LTE, WiMAX 16m, HSPA+, HSPA, TD-SCDMA, GSM and CDMA.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA's IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
About NEC CASIO Mobile Communications, Ltd.
NEC CASIO Mobile Communications provides innovative mobile handsets for major wireless providers in Japan and the U.S.A. The company was established in 2010 after spinning off from NEC Corporation's mobile handset business. Later that year, it merged with Casio Hitachi Mobile Communications Co., Ltd. a joint venture between Casio Computer Co., Ltd., and Hitachi, Ltd. NEC CASIO Mobile Communications aims to build an enriched communication linked society utilizing mobile handset solutions crafted from imagination and creativity. For more information, go to www.nec-casio-mobile.com.
SOURCE CEVA, Inc.
CONTACT: Richard Kingston of CEVA, Inc., +1-650-417-7976, richard.kingston@ceva-dsp.com; or Mike Sottak of Wired Island, Ltd., +1-408-876-4418, mike@wiredislandpr.com
Web Site: www.nec-casio-mobile.com
