NORTH BILLERICA, Mass. – BTU International, Inc. today announced that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium, established by Universal Instruments’ Advanced Process Laboratory. In addition, BTU installed a PYRAMAX™ 100N Reflow Oven with 400°C capability in the state of the art Advanced Process Laboratory (APL).
The A.R.E.A Consortium consists of more than 30 members representing leading companies in the electronics assembly industry. The Consortium aims to develop a fundamental, mechanistic understanding of the materials and processes utilized in electronics assembly, with special focus on maximizing assembly yields and long-term reliability. A team of experienced scientists conducts fast-paced research and reports back results at quarterly meetings. All research is conducted in the APL and takes advantage of the lab’s comprehensive production and analytical equipment set.
“BTU’s ovens and furnaces have long been recognized as performance leaders providing our customers with the utmost in process control. This oven will be used to develop leading-edge processes for semiconductor packaging, high temperature related studies and electronics assembly,” said Rob DiMatteo, BTU’s eastern regional sales manager. “Furthermore our involvement in this consortium extends our ability to partner with customers for process development, it’s a win-win,” added DiMatteo.
BTU’s PYRAMAX™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. PYRAMAX™ systems provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU’s exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry.
About BTU International
BTU International is global supplier and technology leader of advanced thermal processing equipment and processes to the electronics and alternative energy manufacturing markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in solar cell and nuclear fuel manufacturing. BTU has operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service in the USA, Asia and Europe. Information about BTU International is available at www.btu.com.
Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal provides complete assembly lines to EMS providers, ODMs and electronics assemblers around the world, leveraging its portfolio of compatible and flexible equipment platforms that address the diverse requirements of high-speed chip and multifunction placement applications as well as component insertion. Universal Instruments is headquartered in Binghamton, NY, USA, with offices in Europe, Asia, and the Americas.
Vice President Sales and Service
BTU International, Inc.
Phone: (978) 667-4111
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