Beckhoff Puts Scientific Automation in the Spotlight at Pack Expo 2009
Company makes a bold, scientific statement at North America's premier 2009 packaging event
MINNEAPOLIS, October 13, 2009 - For Beckhoff Automation, Pack Expo 2009 marked the year of Scientific Automation - the integration of advanced measurement and condition monitoring technologies into PC-based automation. Beckhoff presented the latest PC- and EtherCAT®-based control technology and the Scientific Automation concept at Pack Expo Las Vegas from October 5 - 7, 2009 in the Las Vegas Convention Center.
Booth S5641, Beckhoff's largest Pack Expo booth ever, became a one-stop information hub for open automation solutions to equip world class packaging machines. Cost-saving Scientific Automation, to eXtreme Fast Control(TM) with EtherCAT, to the newest high performance Industrial PCs and more were on display for the Pack Expo masses inside Beckhoff's 40' x 40' booth.
Beyond Automation: Scientific Automation
Beckhoff Automation refers to the integration of engineering functions that go beyond traditional PLC and motion technologies into automation software as "Scientific Automation." This new way of adding measurement and condition monitoring technologies to the Beckhoff solution builds on the ever-increasing performance of PC-based control technology via multi core Intel® processors and an ultra fast communication system such as EtherCAT along with capable I/O terminals to transmit the measurement data.
"At Pack Expo 2009, Scientific Automation was by far the main event and focus for Beckhoff," said Joe Martin, Packaging and Converting Sales Manager, Beckhoff Automation. "The time is now for machine builders and manufacturers of all industries to harness the power of modern PC processors and inexpensive EtherCAT I/O terminals with measurement functionality to reduce the reliance on expensive, dedicated measurement and lab devices. Via EtherCAT I/O terminals, these functions can now be easily managed by a centralized controller that also handles the automation, motion control and HMI. This drives out costs, improves performance and enhances system flexibility."
Demos - Showing How to Solve Tomorrow's Packaging Needs Today.
Of course, major highlights within Beckhoff's Pack Expo 2009 booth were the demos. The many Beckhoff innovations on display included:
o Scientific Automation with PC-based controllers and EtherCAT terminals covering functions such as vibration, temperature and energy monitoring as well as condition monitoring
o Form, fill, seal packaging systems using powerful IPCs, compact Embedded PCs and high performance EtherCAT drives
o High speed print mark detection for labeling systems with EtherCAT and eXtreme Fast Control (XFC)
o Overall Equipment Effectiveness (OEE)
o Multi-fieldbus support: game-changing EtherCAT with integrated connectivity solutions for EtherNet/IP, PROFINET, CANopen and many more.
For more information: www.scientificautomation.com
Beckhoff Automation provides advanced, open automation products based upon proven technologies so that customers can implement high performance control systems faster and at a lower overall cost than traditional PLC and motion control systems. Beckhoff's "New Automation Technology" product range includes PC based control, industrial PCs, automation controllers, operator interface, I/O, servo drives and motors. With representation in more than 60 countries, Beckhoff is well positioned to provide global sales and service to its customers. Sales and service are handled directly, with no intermediaries involved to provide faster response and improved communications.
Please send readers' questions regarding "Beckhoff Automation and Scientific Automation at Pack Expo 2009" to:
Beckhoff Automation LLC
12150 Nicollet Ave. S
Burnsville, MN 55337
Phone: 952-890-0000
Fax: 952-890-2888
e-mail: beckhoff.usa@beckhoff.com
www.beckhoffautomation.com
Media contact:
Shane Novacek
Beckhoff Automation
Phone: 952-808-6515
s.novacek@beckhoff.com
