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ASTM Standard covers electron backscatter diffraction.
Press Release Summary:
Aug 16, 2010 - ASTM E2627, Practice for Determining Average Grain Size Using Electron Backscatter Diffraction in Fully Recrystallized Polycrystalline Materials, will be useful to metals users and producers. Electron backscatter diffraction can provide precise determinations as well as give information on grain size distribution and statistics. Because EBSD is a direct measurement of grain size, ASTM E2627 can be used to referee disputed measurements made through other techniques.
Original Press Release
New ASTM Standard Covers Use of Electron Backscatter Diffraction to Measure Grain Size
Press release date: Aug 12, 2010
A new ASTM International standard covers electron backscatter diffraction. ASTM E2627, Practice for Determining Average Grain Size Using Electron Backscatter Diffraction (EBSD) in Fully Recrystallized Polycrystalline Materials, was developed by Subcommittee E04.11 on X-Ray and Electron Metallography, part of Committee E04 on Metallography.
"The standard will be most useful to metals users and producers, particularly those whose materials prove difficult for traditional techniques," says John Friel, a retired assistant professor of geology from Temple University, and chairman of E04.11. "Ceramics industries could also use EBSD because their materials are difficult to etch and do not electropolish." Friel also notes that, because EBSD is a direct measurement of grain size, ASTM E2627 can be used to referee disputed measurements made through other techniques.
"EBSD can be used on any crystalline material; thus it is often used for structural and texture studies in geology and materials science," says Friel. "With ASTM E2627, we have adapted the technology and standardized the method of data acquisition and reporting to extract more information from the traditional, yet ongoing, need for grain size measurement."
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View this release on the ASTM Web site at www.astmnewsroom.org.
ASTM Committee E04 Next Meeting: Nov. 15-17, November Committee Week, San Antonio, Texas
Technical Contact: John Friel, Temple University, Philadelphia, Pa., Phone: 215-794-0413; firstname.lastname@example.org
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