Shin-Etsu Microsi, Inc.
Phoenix, AZ 85044
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Dry Film Dielectric Photoresist is intended for 3D TSVs.
SINR series siloxane-based negative photoresist film, available in 12-100 micron thicknesses, will flow into vias to produce void-free dielectric fill and planarized surface. Suited for 3D Through-Silicon Vias (TSVs) and 2D wafer bonding applications, vacuum laminated dry films exhibit minimal residual stress with 90 MPa modulus that produces rubbery consistency and minimizes wafer bow....
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Dry Film Dielectric Photoresist is intended for 3D TSVs.
SINR series siloxane-based negative photoresist film, available in 12-100 micron thicknesses, will flow into vias to produce void-free dielectric fill and planarized surface. Suited for 3D Through-Silicon Vias (TSVs) and 2D wafer bonding applications, vacuum laminated dry films exhibit minimal residual stress with 90 MPa modulus that produces rubbery consistency and minimizes wafer bow....
Read More »