Palomar Technologies
Carlsbad, CA 92010
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Palomar Technologies Highlights New Features of Component Placement System at OFC Booth #3316
OFC 2008, Booth #3316 Carlsbad, Calif. - February 18, 2008 - Palomar Technologies, provider of precision automation equipment, process development, and contract assembly services for microelectronics, will highlight the updated features of its Model 3500-III and the capabilities of its Model 6500 component placement systems at booth #3316 at OFC 2008. The conference will be held February 26 - 28,...
Read More »Microelectronic Packaging Service handles volume manufacturing.
Microelectronic assembly processes include wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high-power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids. Services include process development, prototyping, volume assembly, and test. Once process is refined and optimized, volume production is...
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Prototyping Service utilizes fiber align equipment.
Process Development and Prototyping Service provides design, program management, parts sourcing, process development, assembly, test, and product implementation for products such as optoelectronic packages, MEMS devices, hybrids, highbright LEDs, and fiber optic packages. FAST(TM) Optical Align and Attach products enable automation of active optical alignment and assembly of photonic components...
Read More »Palomar Technologies Highlights New Features of Component Placement System at OFC Booth #3316
OFC 2008, Booth #3316 Carlsbad, Calif. - February 18, 2008 - Palomar Technologies, provider of precision automation equipment, process development, and contract assembly services for microelectronics, will highlight the updated features of its Model 3500-III and the capabilities of its Model 6500 component placement systems at booth #3316 at OFC 2008. The conference will be held February 26 - 28,...
Read More »Microelectronic Packaging Service handles volume manufacturing.
Microelectronic assembly processes include wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high-power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids. Services include process development, prototyping, volume assembly, and test. Once process is refined and optimized, volume production is...
Read More »Palomar's Matrix LED Assembly Capabilities Enable Packaging of Brighter LED Modules
Dan Evans to present paper on Matrix LED Assembly at IMAPS International Conference Carlsbad, Calif. - February 26, 2007 - Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, announced that Dan Evans, senior scientist, will present a paper titled High Brightness Matrix LED Assembly Challenges and Solutions at the Scottsdale,...
Read More »Palomar Technologies Receives ISO 9001:2000 Recertification
Carlsbad, Calif. - October 17, 2006 - Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announced that it has been recertified as meeting the requirements of ISO 9001/ANSI-ASQ Q9001:2000 and is registered by SGS. Palomar was assessed and certified as meeting the requirements of ISO 9001:2000 for design, manufacturing, sales,...
Read More »Palomar Technologies Wins Semiconductor International's Editors' Choice Award
Honored for Model 3500-II Automatic Component Placement Cell Carlsbad, Calif. - July 20, 2006 - Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announces that it received the Editors' Choice Best Product Award for its Model 3500-II Automatic Component Placement Cell. Presented annually by Semiconductor International magazine,...
Read More »Bruce Hueners Named President of Palomar Technologies
Carlsbad, Calif. - January 23, 2006 - Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announced that Bruce W. Hueners has been named company President. Mr. Hueners joined Palomar Technologies in 1981 when it was Hughes Aircraft and most recently held the position of COO. He was instrumental in elevating Palomar to the role of...
Read More »Palomar Wins Global Technology Award for its Precision Gold Wire Bonder and Ball Bumper
Carlsbad, Calif. - December 20, 2005 - Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announced it has received a 2005 Global Technology Award. The award is given by Global SMT & Packaging magazine to recognize the best new innovations in the printed circuit assembly and packaging industries. Palomar won the award for its Model...
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Prototyping Service utilizes fiber align equipment.
Process Development and Prototyping Service provides design, program management, parts sourcing, process development, assembly, test, and product implementation for products such as optoelectronic packages, MEMS devices, hybrids, highbright LEDs, and fiber optic packages. FAST(TM) Optical Align and Attach products enable automation of active optical alignment and assembly of photonic components...
Read More »