Remtec, Inc.

Leadless Ceramic SMT Package meets optoelectronic circuit needs.
Electrical Equipment & Systems

Leadless Ceramic SMT Package meets optoelectronic circuit needs.

JDEC TO-style SMT leadless packages address photonics industry demands for SMT packaging solution as- alternative for standard TO-type packages. SMT packages can be produced for circuits and I/O configurations fully compatible with most JEDEC TO-style window caps, such as TO-8, TO-46, and beyond at operating frequencies up to 10 GHz and higher. Ability to use standard TO-style lids on...

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Leadless Ceramic SMT Package meets optoelectronic circuit needs.
Electrical Equipment & Systems

Leadless Ceramic SMT Package meets optoelectronic circuit needs.

JDEC TO-style SMT leadless packages address photonics industry demands for SMT packaging solution asÂ- alternative for standard TO-type packages. SMT packages can be produced for circuits and I/O configurations fully compatible with most JEDEC TO-style window caps, such as TO-8, TO-46, and beyond at operating frequencies up to 10 GHz and higher. Ability to use standard TO-style lids on...

Read More »
Electronic Components & Devices

LED Packaging is custom tailored to requirements.

Designed to specific customer requirements, LED Substrates and Submounts- utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for bond-pad down devices...

Read More »
Electronic Components & Devices

LED Packaging is custom tailored to requirements.

Designed to specific customer requirements, LED Substrates and SubmountsÂ- utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for...

Read More »
Ceramic Substrates support SMT soldering and die attach.
Electronic Components & Devices

Ceramic Substrates support SMT soldering and die attach.

Norwood, MA –- Remtec, the leading manufacturer of substrates and packages with Plated Copper on Thick Film (PCTF®) metallization, has developed and commercialized a proprietary process that resolves the metallization adhesion and long-term reliability problems caused by using RoHS compliant, lead-free solder alloys processed at high temperature. Remtec’s proprietary process replaces...

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Electronic Components & Devices

Remtec Expands Its Enhanced Power Transfer

Norwood, MA - Remtec, the leading manufacturer of substrates and packages with Plated Copper on Thick Film (PCTF-®) metallization, has expanded its copper plated Power Transfer Via (PTV)(TM) technology into demanding electronic packaging applications required in RF & DC power circuits, ranging from chip scale packages to power modules. By merging the highly thermally and electrically conductive...

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Electronic Components & Devices

Remtec Expands Its Enhanced Power Transfer

Norwood, MA - Remtec, the leading manufacturer of substrates and packages with Plated Copper on Thick Film (PCTFÂ-®) metallization, has expanded its copper plated Power Transfer Via (PTV)(TM) technology into demanding electronic packaging applications required in RF & DC power circuits, ranging from chip scale packages to power modules. By merging the highly thermally and electrically...

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Remtec Expands DBC Substrate Capabilities
Chemicals & Gases

Remtec Expands DBC Substrate Capabilities

Norwood, MA - Remtec-®, the leading manufacturer of substrates and packages with Plated Copper On Thick Film (PCTF®), has significantly expanded its activity in the design and fabrication of DBC ceramic products for military and commercial applications in small to medium production volumes with fast prototyping and economic pricing. This capability is supported by close cooperation with...

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Remtec Expands DBC Substrate Capabilities
Chemicals & Gases

Remtec Expands DBC Substrate Capabilities

Norwood, MA - RemtecÂ-®, the leading manufacturer of substrates and packages with Plated Copper On Thick Film (PCTF®), has significantly expanded its activity in the design and fabrication of DBC ceramic products for military and commercial applications in small to medium production volumes with fast prototyping and economic pricing. This capability is supported by close cooperation...

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Company News

Remtec Achieves 20% Growth In 2018, Expands Facilities, Adds Personnel and Equipment to Improve Overall Productivity

Norwood, MA. April 8, 2019. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has increased sales 20% in 2018. This marks the second consecutive year of double-digit growth. Remtec hired new personnel in all departments including sales, production, quality assurance and engineering...

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Company News

Remtec Achieves 20% Growth In 2018, Expands Facilities, Adds Personnel and Equipment to Improve Overall Productivity

Norwood, MA. April 8, 2019. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has increased sales 20% in 2018. This marks the second consecutive year of double-digit growth. Remtec hired new personnel in all departments including sales, production, quality assurance and engineering...

Read More »
Mergers & Acquisitions

Remtec Has Been Acquired by LTI, A Leading Manufacturer of Precision Glass-To-Metal Seals

Norwood, MA.- – Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF (Plated Copper on Thick Film) metallization, has been acquired by LTI (www.legacytechnologies.com), a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages. In making the announcement to employees and customers, Remtec...

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Mergers & Acquisitions

Remtec Has Been Acquired by LTI, A Leading Manufacturer of Precision Glass-To-Metal Seals

Norwood, MA.Â- – Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF (Plated Copper on Thick Film) metallization, has been acquired by LTI (www.legacytechnologies.com), a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages. In making the announcement to employees and customers, Remtec...

Read More »
Leadless Ceramic SMT Package meets optoelectronic circuit needs.
Electrical Equipment & Systems

Leadless Ceramic SMT Package meets optoelectronic circuit needs.

JDEC TO-style SMT leadless packages address photonics industry demands for SMT packaging solution as- alternative for standard TO-type packages. SMT packages can be produced for circuits and I/O configurations fully compatible with most JEDEC TO-style window caps, such as TO-8, TO-46, and beyond at operating frequencies up to 10 GHz and higher. Ability to use standard TO-style lids on...

Read More »
Leadless Ceramic SMT Package meets optoelectronic circuit needs.
Electrical Equipment & Systems

Leadless Ceramic SMT Package meets optoelectronic circuit needs.

JDEC TO-style SMT leadless packages address photonics industry demands for SMT packaging solution asÂ- alternative for standard TO-type packages. SMT packages can be produced for circuits and I/O configurations fully compatible with most JEDEC TO-style window caps, such as TO-8, TO-46, and beyond at operating frequencies up to 10 GHz and higher. Ability to use standard TO-style lids on...

Read More »
Electronic Components & Devices

LED Packaging is custom tailored to requirements.

Designed to specific customer requirements, LED Substrates and Submounts- utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for bond-pad down devices...

Read More »
Electronic Components & Devices

LED Packaging is custom tailored to requirements.

Designed to specific customer requirements, LED Substrates and SubmountsÂ- utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for...

Read More »
Ceramic Substrates support SMT soldering and die attach.
Electronic Components & Devices

Ceramic Substrates support SMT soldering and die attach.

Norwood, MA –- Remtec, the leading manufacturer of substrates and packages with Plated Copper on Thick Film (PCTF®) metallization, has developed and commercialized a proprietary process that resolves the metallization adhesion and long-term reliability problems caused by using RoHS compliant, lead-free solder alloys processed at high temperature. Remtec’s proprietary process replaces...

Read More »

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