Advanced Interconnections Corp.
West Warwick, RI 02893
Advanced Interconnections Quality System Meets ISO 9001:2008 Standard
West Warwick, RI, - Advanced Interconnections Corp. (Advanced) recently passed a comprehensive ISO audit, successfully earning recertification for its quality management system to the ISO 9001:2008 Standard. With an increased focus on customized interconnect solutions, attention to customer requirements is critical to ensure that our precision engineered products perform as expected in high...
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SMT Connectors (1 mm) are available with 36 positions.
Designed for 1 mm pitch micro board-to-board and flex cable-to-board applications, low-profile (4 mm, mated) Mezza-pede(TM) 2-piece connector system has passed mixed flowing gas test and suits high-reliability applications in demanding environments. Fully surface mountable pin and lead frame design features screw-machined terminals with multi-finger contacts. Over-molded lead frame seals surface...
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SMT Connectors come in 19.05 mm mated height.
Designed for 1.27 mm pitch, board-to-board applications, B2BÃ-® High Density SMT Connectors come in 8- and 10-row configurations from 240-500 positions. Units employ screw-machined terminals with multi-finger contacts and solder ball terminal design. With current rating of 3 A/pin and stack heights from 6-19.05 mm, connectors are suited for mezzanine board stacking applications....
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500 Position B2B-® SMT Connectors Now Available for High I/O Board Stacking
500 Position B2B-® SMT Connectors Now Available For High I/O Board Stacking WEST WARWICK, RI, May 7, 2007 - The B2B-® High Density SMT Connector line from Advanced Interconnections Corp. is now available in a 500 position footprint on 1.27mm pitch. Designed for high I/O board to board applications where durability and reliability are critical, such as servers and routers, the newest member of...
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SMT Connectors withstand demands of blind mating.
Suitable for 1.27 mm pitch surface mount board stacking applications, B2BÃ-® High Density SMT Connectors employ screw-machined terminals with multi-finger contacts and solder ball terminal design. They offer over 400 contacts/in.Ã-² and are provided with pick-up caps (male) or polyimide dots (female) to facilitate automated pick-and-place. Polarized male and female engagement prevents...
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Socket Adapter System features hybrid design.
Designed for development and validation of BGA and LGA devices, 0.50 mm pitch BGA Socket Adapter System utilizes screw-machined terminals with multi-finger contacts arranged in interstitial male/female pin pattern. Alignment pins protect pin field and aid in hand placement, with optional stand-offs available. Product features eutectic tin/lead solder balls or lead-free tin/silver/copper solder...
Read More »Sockets protect image sensors during board processing.
Offered in standard, footprint-specific, and custom configurations, image sensor sockets feature screw-machined terminals and multi-fingered contacts. Standard sockets are available in FR-4 insulators in thru-hole and surface-mount designs. With options such as molded or Peel-A-WayÃ-® insulators and lead-free designs, products are suited for applications from scanners to security systems to...
Read More »Sockets accommodate BGA, LGA, and CSP devices to 27 mm-².
Molded from high-temperature thermoplastic, 1.00 mm pitch BGA Sockets in precision molded wafers exhibit coplanarity within .006 in. and feature screw-machined terminals with multifinger contacts and gold plating. Full grid wafers are pin loaded to any footprint specific pattern up to 26 x 26 rows. Surface mount sockets utilize eutectic solder ball terminals, and thru-hole models are available...
Read More »Test Fixture Boards utilize surface mount technology.
Custom Test Fixture Boards electrically interface test equipment to ball grid array packages. Multilayer FR-4 assemblies incorporate cable-to-board connectors and True BGA Socket(TM), which eliminates need to solder BGA to adapter. Electrical continuity is assured by spring-loaded beryllium copper contacts loaded in pogo pin terminals, the heads of which are compressed against balls of BGA...
Read More »BGA Socket takes up less space.
Compact True BGA Socket(TM) reduces PC board space for BGA and LGA device socketing in development, test, and production applications. Approximate height without heat sink is 0.67 in. from PC board. Socket is available in any 0.050 in. pitch footprint, conforms to industry standard coplanarity, and has gold plated terminals and contacts with integral, finned heatsink or coin screw retention...
Read More »Advanced Interconnections Completes Transition to New ISO 9001:2015 Standard
West Warwick, R.I., USA, January 9, 2018 - Advanced Interconnections Corp. (AIC), a leading manufacturer of PC board connectors and semiconductor sockets, is pleased to announce the successful recertification of its quality management system to the newest ISO 9001 Standard. ISO 9001:2015 is focused on consistently meeting customer and regulatory requirements while striving for process improvement...
Read More »Advanced Interconnections Quality System Meets ISO 9001:2008 Standard
West Warwick, RI, - Advanced Interconnections Corp. (Advanced) recently passed a comprehensive ISO audit, successfully earning recertification for its quality management system to the ISO 9001:2008 Standard. With an increased focus on customized interconnect solutions, attention to customer requirements is critical to ensure that our precision engineered products perform as expected in high...
Read More »
SMT Connectors (1 mm) are available with 36 positions.
Designed for 1 mm pitch micro board-to-board and flex cable-to-board applications, low-profile (4 mm, mated) Mezza-pede(TM) 2-piece connector system has passed mixed flowing gas test and suits high-reliability applications in demanding environments. Fully surface mountable pin and lead frame design features screw-machined terminals with multi-finger contacts. Over-molded lead frame seals surface...
Read More »
SMT Connectors come in 19.05 mm mated height.
Designed for 1.27 mm pitch, board-to-board applications, B2BÃ-® High Density SMT Connectors come in 8- and 10-row configurations from 240-500 positions. Units employ screw-machined terminals with multi-finger contacts and solder ball terminal design. With current rating of 3 A/pin and stack heights from 6-19.05 mm, connectors are suited for mezzanine board stacking applications....
Read More »
500 Position B2B-® SMT Connectors Now Available for High I/O Board Stacking
500 Position B2B-® SMT Connectors Now Available For High I/O Board Stacking WEST WARWICK, RI, May 7, 2007 - The B2B-® High Density SMT Connector line from Advanced Interconnections Corp. is now available in a 500 position footprint on 1.27mm pitch. Designed for high I/O board to board applications where durability and reliability are critical, such as servers and routers, the newest member of...
Read More »Advanced Interconnections Honors Bisco Industries at EDS 2007
West Warwick, RI, May 24, 2007 - Advanced Interconnections Corp. recently named Bisco Industries as 2006 N. American Distributor of the Year. The award was presented on May 15, 2007 at the EDS trade show in Las Vegas, NV, by Ron Bond, Sales Manager for the North American Region to Robert Rist, Northern Region Sales Manager for Bisco. Bisco Industries has over 34 locations throughout the U.S. and...
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SMT Connectors withstand demands of blind mating.
Suitable for 1.27 mm pitch surface mount board stacking applications, B2BÃ-® High Density SMT Connectors employ screw-machined terminals with multi-finger contacts and solder ball terminal design. They offer over 400 contacts/in.Ã-² and are provided with pick-up caps (male) or polyimide dots (female) to facilitate automated pick-and-place. Polarized male and female engagement prevents...
Read More »
Socket Adapter System features hybrid design.
Designed for development and validation of BGA and LGA devices, 0.50 mm pitch BGA Socket Adapter System utilizes screw-machined terminals with multi-finger contacts arranged in interstitial male/female pin pattern. Alignment pins protect pin field and aid in hand placement, with optional stand-offs available. Product features eutectic tin/lead solder balls or lead-free tin/silver/copper solder...
Read More »Peel-A-Way-® Removable Terminal Carriers Meet RoHS Compliant Requirements
West Warwick, RI, September 20, 2005 - Advanced Interconnections Corp. has recently completed RoHS Compliant testing on its patented Peel-A-WayÃ-® Removable Terminal Carrier products. All Peel-A-WayÃ-® PGA, DIP, SIP and Board to Board Connectors with lead-free terminal plating meet the RoHS Directive's requirements for material content and can withstand the higher temperatures associated...
Read More »Sockets protect image sensors during board processing.
Offered in standard, footprint-specific, and custom configurations, image sensor sockets feature screw-machined terminals and multi-fingered contacts. Standard sockets are available in FR-4 insulators in thru-hole and surface-mount designs. With options such as molded or Peel-A-WayÃ-® insulators and lead-free designs, products are suited for applications from scanners to security systems to...
Read More »