Microchip Technology Inc.

New 53100A Phase Noise Analyzer Measures RF Signals up to 200 MHz
Laboratory and Research Supplies and Equipment

New 53100A Phase Noise Analyzer Measures RF Signals up to 200 MHz

Enables variety of configurations by allowing up to three separate devices to be tested simultaneously using a single reference, enabling higher capacity for stability measurements. Provides flexibility by allowing an input reference device to be connected through the front panel at a different nominal frequency than the device under test. Designed for engineers and scientists who rely on...

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New 53100A Phase Noise Analyzer Measures RF Signals up to 200 MHz
Laboratory and Research Supplies and Equipment

New 53100A Phase Noise Analyzer Measures RF Signals up to 200 MHz

Enables variety of configurations by allowing up to three separate devices to be tested simultaneously using a single reference, enabling higher capacity for stability measurements. Provides flexibility by allowing an input reference device to be connected through the front panel at a different nominal frequency than the device under test. Designed for engineers and scientists who rely on...

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New SiC Power Module Provides Reliability and Ruggedness
Controls & Controllers

New SiC Power Module Provides Reliability and Ruggedness

Includes commercially-qualified SBD-based power modules in 700, 1200 and 1700V variants. Available with various topologies including dual diode, full bridge, phase leg, dual common cathode and 3-phase bridge in addition to offering different current and package options. Simplifies designs by integrating multiple SiC diode die with the option to mix and match substrate and baseplate material into...

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New SiC Power Module Provides Reliability and Ruggedness
Controls & Controllers

New SiC Power Module Provides Reliability and Ruggedness

Includes commercially-qualified SBD-based power modules in 700, 1200 and 1700V variants. Available with various topologies including dual diode, full bridge, phase leg, dual common cathode and 3-phase bridge in addition to offering different current and package options. Simplifies designs by integrating multiple SiC diode die with the option to mix and match substrate and baseplate material into...

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New Embedded IoT Solutions for Edge Computing
Agricultural & Farming Products

New Embedded IoT Solutions for Edge Computing

PIC and AVR MCU development boards with rapid prototyping tool developed in collaboration with AWS, help designers connect IoT sensor nodes to the AWS IoT core service via Wi-Fi. ATSAMA5D27-WLSOM1 integrates the SAMA5D2 MPU, WILC3000 Wi-Fi and Bluetooth combo module powered by the MCP16502 high performance PMIC. SAM-IoT WG connects the google cloud IoT core with 32-bit SAM-D21 Arm® Cortex® M0+...

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New Embedded IoT Solutions for Edge Computing
Agricultural & Farming Products

New Embedded IoT Solutions for Edge Computing

PIC and AVR MCU development boards with rapid prototyping tool developed in collaboration with AWS, help designers connect IoT sensor nodes to the AWS IoT core service via Wi-Fi. ATSAMA5D27-WLSOM1 integrates the SAMA5D2 MPU, WILC3000 Wi-Fi and Bluetooth combo module powered by the MCP16502 high performance PMIC. SAM-IoT WG connects the google cloud IoT core with 32-bit SAM-D21 Arm® Cortex® M0+...

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