KLA-Tencor Corp.

Optics & Photonics

KLA-Tencor Enables Production Monitoring for High-Brightness LED Market with New Automated Wafer Inspection System

SAN JOSE, Calif., Nov. 9 / -- KLA-Tencor (NASDAQ:KLAC) today introduced the Candela CS20 -- the first automated wafer inspection system designed to address the defect management requirements of the rapidly growing high-brightness light-emitting diode (HB-LED) market. Leveraging a proprietary, multi-channel detection architecture, the CS20 can inspect transparent wafers and epi layers for...

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Computer Hardware & Peripherals

Analyzer facilitates lithography cell qualification.

Integrated with Archer overlay, eCD CD SEM, and SpectraCD optical CD metrology platforms for 65 nm and below IC production, K-T Analyzer lithography correctable platform provides automated, on-tool analysis of overlay and critical dimension metrology data in real time. System gives engineers immediate feedback on quality of lithography process, enabling them to correct errors, minimize...

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Laboratory and Research Supplies and Equipment

Photomask Inspection System works at and below 65 nm node.

STARlight-2(TM) provides wafer fabs with contamination inspection solution for all types of photomasks, including mainstream extreme resolution enhancement technique photomasks. With inspection capabilities designed for detection of progressive defects, product features 90 and 125 nm pixel sizes that provide resolution and sensitivity needed to detect mask contaminants on device layers with...

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Test & Measurement

Inspection System finds defects in wafers and process tools.

Providing simultaneous brightfield and darkfield inspection channels, Viper 2435 Automated Dispositioning System detects broad range of critical defects at sampling rates up to 100 wafer/hr. Using tool at lithography, CMP, etch, and film modules, fab can flag wafers with defects that require corrective action, while bypassing wafers having nuisance defects. Viper 2435 integrates with Klarity®...

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Test & Measurement

CD Metrology System aids 90 and 65 nm IC manufacturing.

SpectraCD-XT provides inline CD and profile measurements of critical device structures that help enable early prediction of IC performance and yield at 90 and 65 nm nodes. Suited for high-volume IC manufacturers, this spectroscopic ellipsometry-based CD metrology tool features sub-2 sec move-acquire-measure time and throughput rated up to 100+ wph. Optics use oblique illumination, enabling...

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Test & Measurement

E-Beam Inspection System handles nodes 65 nm and smaller.

Helping identify and overcome front-end-of-line (FEOL) issues in integrating NiSi and strained silicon into devices, eS32 e-beam inspection platform enables capture of subtle electrical and small physical defects at 65 and 45 nm nodes. It facilitates detection and resolution of systematic, yield-limiting defects in FEOL and back-end-of-line (BEOL) applications. Product also captures slight...

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Software

System provides lithography-aware design inspection.

Suited for 90 nm and below designs where lithography process windows are extremely small, DesignScan enables inline inspection of post-RET reticle designs for errors through process window. It lets users identify and optimize design-related performance and yield-limiting patterns before committing design to mask production. DesignScan inspection can be run across full process window at...

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Test & Measurement

Fly-Height Tester is suited for HDD manufacturers.

Designed for data storage industry, D6 fly-height metrology system uses laser-based phase interferometer to test down to contact with precision within 0.15 nm and matching within 0.64 nm. Multiple signals are used to directly discern differential phase of light reflected off recording head surface without need for calibrating intensity envelope of interference fringes. Measurement principle...

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Software

Software optimizes wafer design for manufacturability.

PROLITH v9.0 helps optimize mask designs and lithography processes for design for manufacturability (DFM). It also helps predict manufacturability of extreme resolution enhancement techniques using multi-algorithm simulations that take minutes to complete. Mask Defect option enables users to determine printability of mask defects and their impact on process windows. Users can also simultaneously...

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