KLA-Tencor Corp.

Computer Hardware & Peripherals

Film Metrology Tool aids semiconductor manufacturing.

Utilizing Patented Broadband Spectroscopic Ellipsometry, white light reflectometry, and optional UV reflectometry optics technologies, Aleris(TM) 8330 measures film thickness, refractive index, and stress of non-critical films at 32 nm node and beyond. Unit offers remote recipe management and enables recipe import from previous generation platforms. Recipe sharing among Aleris tools facilitates...

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Machinery & Machining Tools

Recticle Inspector and Wafer Defect Tools aid in early detection.

TeraFab(TM)HT reticle inspector includes STARlight(TM) mode for inspection of single-die and multi-product masks and designs employing small optical proximity correction features. Model eDR-5210S e-beam wafer defect review system offers accurate wafer dispositioning using data from TeraFabHT about mask orientation and defect characteristics, and speeds review of potential defect sites. Both work...

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Test & Measurement

Overlay Metrology System suits memory and logic devices.

Archer(TM) 300 LCM metrology system enables in-line monitoring and scanner qualification for 1Xnm half-pitch memory and 2Xnm logic technologies. Unit is able to accurately measure overlay error on double-patterning and other challenging layers, and uses double patterning lithography to reduce tolerable error to just few nanometers at 32 nm node. It meets strict specifications required to qualify...

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Virtual Lithography Tool addresses EUV and DPL challenges.
Software

Virtual Lithography Tool addresses EUV and DPL challenges.

PROLITH(TM) X3.1 lets researchers troubleshoot issues in EUV and double patterning lithography (DPL) processes, including line edge roughness (LER) and patterning issues associated with wafer topography. First-principle physics help investigate and optimize lithography processes by simulating patterning results. While stochastic model takes into account quantum behavior of light and discrete...

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Test & Measurement

LED Wafer Inspector optimizes throughput and accuracy.

Featuring automated optical inspection capabilities, ICOS® WI-2250 fosters transition to larger LED and MEMS wafer sizes for manufacturers. It allows for defect inspection of whole and diced wafers up to 200 mm, with macro inspection sensitivity in pre- and post-dice inspection of high-brightness LEDs and MEMS wafers. Rule-based binning lends to real-time defect classification, advanced...

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Test & Measurement

Metrology System measures multi-layer film thickness.

Suited for production monitoring of critical gate applications on product wafers and 45/32 nm development, Aleris 8500 combines composition and multi-layer film thickness metrology. It is built on SpectraFx 200 technology featuring 150 nm Broadband Spectroscopic Ellipsometry (BBSE(TM)) optics. Single-tool solution comes with StressMapper(TM) module that provides high spatial resolution for...

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Software

Metrology Software verifies plasma etch chamber health.

Used with SensArray wafer-level metrology tools, PlasmaWafer Suite provides chipmakers and etch equipment suppliers with measurement capability to help verify plasma etch chamber health and identify problems such as drift, non-uniformity, and slight differences in chamber matching. Suite includes PlasmaSuite diagnostic module with statistical process control (SPC), subsystem-level...

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Test & Measurement

Wafer Inspection System handles 65 nm and 45 nm nodes.

Puma 91xx Series darkfield inspection system incorporates Streak(TM) multi-pixel sensor and line scanning technologies to achieve high-resolution darkfield imaging inspection. Suited for DRAM, SRAM, Flash, and logic devices, system utilizes Fast Adaptive Single Threshold (FAST) algorithm for reducing number of parameters needed to create and tune tool recipes. Inline Defect Organizer(TM) enables...

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Laboratory and Research Supplies and Equipment

Surface Analyzer measures roughness and micro-waviness.

With spatial bandwidth coverage from 0.22-2,000 microns and noise floor below 0.5 angstroms, Candela Optical Surface Analyzer 6300 Series delivers metrology and inspection capabilities for data storage substrates and finished media in both radial and circumferential directions. Multi-channel optics, combined with laser stability management technology, delivers measurement capabilities for edge...

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