KLA-Tencor Corp.

Wafer Inspection System detects defects on all surfaces.
Computer Hardware & Peripherals

Wafer Inspection System detects defects on all surfaces.

Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster...

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KLA-Tencor Announces New Flagship Wafer Inspection Solution Suite to Support Advanced Design-Rule Chip Manufacturing: 2900 Series, Puma 9650 Series, eS800 Series
Test & Measurement

KLA-Tencor Announces New Flagship Wafer Inspection Solution Suite to Support Advanced Design-Rule Chip Manufacturing: 2900 Series, Puma 9650 Series, eS800 Series

MILPITAS, Calif. - Today KLA-Tencor Corporation (NASDAQ: KLAC), announced three new wafer defect inspection systems for leading-edge chip manufacturers: the 2900, Puma 9650 and eS800 systems. This new flagship suite is designed to address the wide range of defect issues that new materials, structures and design rules have imposed on manufacturers of advanced chips. The new 2900 Series broadband...

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Computer Hardware & Peripherals

Wafer Defect Review System is designed for 20 nm node.

Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation...

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Wafer Inspection System incorporates deep UV illumination.
Laboratory and Research Supplies and Equipment

Wafer Inspection System incorporates deep UV illumination.

Leveraging DUV wavelength, special apertures, and multiple illumination and collection channels, Surfscan SP3 addresses stringent 28 nm node requirements for defect detection and classification on blanket films at production speeds. System helps manufacture substrates for 28 nm devices and below that are nearly atomically smooth and free from polish marks, crystalline pits, terracing, voids, or...

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Test & Measurement

KLA-Tencor(TM) Announces First Shipment of LMS IPRO5 Next-Generation Reticle Metrology System

Accelerating Advanced Reticle Development and Manufacturing MILPITAS, Calif. - Today KLA-Tencor Corporation(TM) (NASDAQ: KLAC) announced shipment of the first LMS IPRO5 reticle pattern placement metrology system. The recipient, the Advanced Mask Technology Center (AMTC) in Dresden, Germany, intends to use the system to support development of advanced reticle technology that will be used to...

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Sensors, Monitors & Transducers

Defect Analysis System is suited for PV cell manufacturers.

FabVision(TM) Solar utilizes ICOS® PVI-6 data through range of analysis and monitoring features, captures wafer/cell images and data from PVI-6, and allows navigation that simplifies image review. Users can review in-line data at any point, and reports are generated automatically with optical inspection measurement results from multiple inspection modules across multiple manufacturing lines....

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Test & Measurement

KLA-Tencor(TM) and TEL Announce New SpectraShape(TM) Dimensional Metrology Systems With AcuShape(TM)2 Next-Generation Modeling Capability

For Characterization and Production Monitoring of Geometrically Complex Structures of High-Performance Integrated Circuits MILPITAS, Calif. - Today KLA-Tencor Corporation(TM) (Nasdaq: KLAC) announced the SpectraShape(TM) 8660 and 8810 dimensional metrology systems, featuring AcuShape(TM)2 modeling software developed jointly with Tokyo Electron Limited (TEL). The new SpectraShape tools are able to...

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Test & Measurement

Packaged IC Component Inspector features dual taper output.

ICOS® CI-T620 is automated optical inspector of IC packages that enables 3D measurements and is compatible with tape and reel packing. Offering 3D metrology inspection down to 5 -µm, unit can also capture surface defects down to 40 -µm and allows for package changeover in less than 5 min. Product is compatible with package sizes from 3 x 3 mm to 42.5 x 42.5 mm.

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Test & Measurement

Wafer Inspection System aids high brightness LED manufacturing.

Providing automated sub-micron defect inspection for LED materials such as gallium nitride, sapphire, and silicon carbide, Candela® 8620 enables optimized quality control of both opaque and transparent substrates as well as maximum MOCVD reactor uptime and yield. Imaging and detection system optimizes signal from relevant defects-of-interest while suppressing background noise. Aided by...

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Test & Measurement

Wafer Inspection Tool detects edge profile, metrology, defect.

Complimenting existing edge defect inspection and review functionality, capabilities of VisEdge CV300R-EP help fabs identify potentially yield-impacting irregularities in shape of wafer edge profile or edges of films deposited on wafer. Tool provides calibrated measurement of profile of wafer edge, including slope of bevel on which film edge may land. Additionally, system incorporates data from...

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