KLA-Tencor Corp.

New IC Metrology Systems are Ideal for 5G, AI, Data Centers and Edge Computing Applications
Test & Measurement

New IC Metrology Systems are Ideal for 5G, AI, Data Centers and Edge Computing Applications

Available in Archer™ 750 overlay and SpectraShape™ 11k optical critical dimension models. Archer 750 overlay metrology system generates accurate and robust measurements of overlay error in the presence of process variation. SpectraShape 11k CD and dimensional shape metrology system provides sensitivity and productivity that accommodates materials, structures and wafer shapes.

Read More »
New 392x and 295x Optical Inspection Systems Achieve Unparalleled Levels of Sensitivity
Sensors, Monitors & Transducers

New 392x and 295x Optical Inspection Systems Achieve Unparalleled Levels of Sensitivity

Use different wavelength ranges to cover inspection applications for all layers. eDR7380 e-beam wafer defect review system provides fast defect sourcing in development, fast excursion detection and more accurate, actionable data during production. Designed to accelerate time-to-market for leading-edge 3D NAND, DRAM and logic integrated circuits (ICs) throughout their product lifecycle.

Read More »
KLA-Tencor Offers Kronos 1080 and ICOS F160 Systems for Production-Worthy Defect Detection
Test & Measurement

KLA-Tencor Offers Kronos 1080 and ICOS F160 Systems for Production-Worthy Defect Detection

The Kronos™ 1080 System comes with a higher-density metal patterns and multi-layer redistribution layers. It features multi-mode optics, sensors and advanced defect detection algorithms and is suitable for mobile, networking and high-performance computing applications. The ICOS™ F160 system is used in the detection of laser-groove, hairline and sidewall cracks and allows user to change input...

Read More »
KLA-Tencor Introduces New Metrology Systems for Leading-Edge Integrated Circuit Device Technologies
Services

KLA-Tencor Introduces New Metrology Systems for Leading-Edge Integrated Circuit Device Technologies

Comprehensive Process Control Facilitates Advanced Multi-Patterning Techniques and EUV Lithography MILPITAS, Calif., Feb. 22, 2017 - KLA-Tencor Corporation (NASDAQ: KLAC) today introduced four innovative metrology systems that enable development and high-volume manufacturing of sub-10nm integrated circuit (IC) devices: the Archer™ 600 overlay metrology system, the WaferSight™ PWG2 patterned...

Read More »
Reticle Inspection Systems qualify masks 10 nm and below.
Test & Measurement

Reticle Inspection Systems qualify masks 10 nm and below.

Utilizing Dual Imaging technology, Teron™ 640 offers sensitivity necessary to accurately qualify advanced optical masks. Teron™ SL655 with STARlightGold™ technology helps IC manufacturers assess incoming reticle quality, monitor reticle degradation, and detect yield-critical reticle defects. Measurements produced by Teron models are supported by Reticle Decision Center, a data analysis and...

Read More »
Machinery & Machining Tools

Wafer Defect Inspection/Review Systems aid IC device manufacture.

Employing diverse technologies, 3900Â- and 2930 Series broadband plasma optical inspectors, Puma™ 9980 laser scanning inspector, CIRCL™5 all-surface inspection cluster, Surfscan® SP5XP unpatterned wafer inspector, and eDR7280™ e-beam review and classification tool form wafer inspection solution that enables discovery and control of yield-critical defects at all stages of IC...

Read More »
Inspection System supports advanced semiconductor packaging.
Computer Hardware & Peripherals

Inspection System supports advanced semiconductor packaging.

Designed for characterization and monitoring of processes used in wafer-level packaging, CIRCL-AP™ enables all-surface wafer defect inspection, review, and metrology at high throughput. ICOS® T830 provides fully automated optical inspection of IC packages, leveraging sensitivity with 2D and 3D measurements to determine final package quality for diverse device types and sizes. Both systems...

Read More »
KLA-Tencor Extends Its 5D(TM) Patterning Control Solution with New Metrology Systems
Test & Measurement

KLA-Tencor Extends Its 5D(TM) Patterning Control Solution with New Metrology Systems

Comprehensive Overlay and Films Process Control Solutions Address Advanced IC Process Challenges MILPITAS, Calif.Â- — Today, KLA-Tencor Corporation (NASDAQ: KLAC) introduced two advanced metrology systems that support the development and production of 16nm and below IC devices: Archer™ 500LCM and SpectraFilm™ LD10. The Archer 500LCM overlay metrology system provides accurate overlay...

Read More »
KLA-Tencor Introduces Key Systems for 5D(TM) Patterning Control Solution
Machinery & Machining Tools

KLA-Tencor Introduces Key Systems for 5D(TM) Patterning Control Solution

Accelerating The Ramp Of Advanced Patterning Techniques For Sub-20nm Design Nodes MILPITAS, Calif., -- Today, KLA-Tencor Corporation (NASDAQ: KLAC) introduced the WaferSight(TM) PWG patterned wafer geometry measurement system, the LMS IPRO6 reticle pattern placement metrology system and the K-T Analyzer(®) 9.0 advanced data analysis system. These three new products support KLA-Tencor's...

Read More »
Machinery & Machining Tools

KLA-Tencor Introduces Inspection and Review Portfolio for Leading IC Technologies

Systems Offer Comprehensive Defect Information for Solving Yield Challenges SAN FRANCISCO -- Today at SEMICON West, KLA-Tencor Corporation (NASDAQ: KLAC) announced four new systems--the 2920 Series, Puma(TM) 9850, Surfscan® SP5 and eDR(TM)-7110--that provide advanced defect inspection and review capability for the development and production of 16nm and below IC devices. The 2920 Series...

Read More »
New IC Metrology Systems are Ideal for 5G, AI, Data Centers and Edge Computing Applications
Test & Measurement

New IC Metrology Systems are Ideal for 5G, AI, Data Centers and Edge Computing Applications

Available in Archer™ 750 overlay and SpectraShape™ 11k optical critical dimension models. Archer 750 overlay metrology system generates accurate and robust measurements of overlay error in the presence of process variation. SpectraShape 11k CD and dimensional shape metrology system provides sensitivity and productivity that accommodates materials, structures and wafer shapes.

Read More »
New 392x and 295x Optical Inspection Systems Achieve Unparalleled Levels of Sensitivity
Sensors, Monitors & Transducers

New 392x and 295x Optical Inspection Systems Achieve Unparalleled Levels of Sensitivity

Use different wavelength ranges to cover inspection applications for all layers. eDR7380 e-beam wafer defect review system provides fast defect sourcing in development, fast excursion detection and more accurate, actionable data during production. Designed to accelerate time-to-market for leading-edge 3D NAND, DRAM and logic integrated circuits (ICs) throughout their product lifecycle.

Read More »
Company News

KLA Receives Intel's Preferred Quality Supplier Award

MILPITAS, Calif., March 27, 2019 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) is proud to announce that the company has received the Intel 2018 Preferred Quality Supplier (PQS) award, with Distinguished Performance in Safety, for its process control capital equipment and services. "Intel's award-winning suppliers are critical to Intel's success," said Jacklyn Sturm,...

Read More »
Mergers & Acquisitions

KLA Completes Acquisition of Orbotech Ltd.

MILPITAS, Calif., Feb. 20, 2019 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). "We are very pleased to have completed the acquisition of Orbotech," said Rick Wallace, president and CEO of KLA. "This new combination extends KLA's market reach within the electronics value chain, opens new high-growth...

Read More »
KLA-Tencor Offers Kronos 1080 and ICOS F160 Systems for Production-Worthy Defect Detection
Test & Measurement

KLA-Tencor Offers Kronos 1080 and ICOS F160 Systems for Production-Worthy Defect Detection

The Kronos™ 1080 System comes with a higher-density metal patterns and multi-layer redistribution layers. It features multi-mode optics, sensors and advanced defect detection algorithms and is suitable for mobile, networking and high-performance computing applications. The ICOS™ F160 system is used in the detection of laser-groove, hairline and sidewall cracks and allows user to change input...

Read More »
KLA-Tencor Introduces New Metrology Systems for Leading-Edge Integrated Circuit Device Technologies
Services

KLA-Tencor Introduces New Metrology Systems for Leading-Edge Integrated Circuit Device Technologies

Comprehensive Process Control Facilitates Advanced Multi-Patterning Techniques and EUV Lithography MILPITAS, Calif., Feb. 22, 2017 - KLA-Tencor Corporation (NASDAQ: KLAC) today introduced four innovative metrology systems that enable development and high-volume manufacturing of sub-10nm integrated circuit (IC) devices: the Archer™ 600 overlay metrology system, the WaferSight™ PWG2 patterned...

Read More »
Mergers & Acquisitions

KLA-Tencor Announces Termination Of Merger Agreement With Lam Research

MILPITAS, Calif., Oct. 5, 2016Â- - KLA-Tencor Corporation (NASDAQ: KLAC) (the Company") and Lam Research Corp. (NASDAQ: LRCX) today announced that they have agreed to terminate their proposed merger agreement. The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice (the "DOJ") advised...

Read More »
Reticle Inspection Systems qualify masks 10 nm and below.
Test & Measurement

Reticle Inspection Systems qualify masks 10 nm and below.

Utilizing Dual Imaging technology, Teron™ 640 offers sensitivity necessary to accurately qualify advanced optical masks. Teron™ SL655 with STARlightGold™ technology helps IC manufacturers assess incoming reticle quality, monitor reticle degradation, and detect yield-critical reticle defects. Measurements produced by Teron models are supported by Reticle Decision Center, a data analysis and...

Read More »
Machinery & Machining Tools

Wafer Defect Inspection/Review Systems aid IC device manufacture.

Employing diverse technologies, 3900Â- and 2930 Series broadband plasma optical inspectors, Puma™ 9980 laser scanning inspector, CIRCL™5 all-surface inspection cluster, Surfscan® SP5XP unpatterned wafer inspector, and eDR7280™ e-beam review and classification tool form wafer inspection solution that enables discovery and control of yield-critical defects at all stages of IC...

Read More »

All Topics