Applied Materials, Inc.

Machinery & Machining Tools

Applied Materials Leads the Way to Enable TSV Interconnects for 3D Chip Stacking

o TSVs are a key driver of 3D chip packaging for future mobile communications devices o Applied introduces latest innovation for TSV production with Producer Avila system o Applied is first to integrate full portfolio of systems for fabricating TSVs in 3D-ICs SEMICON West 2010 SANTA CLARA, Calif.--Applied Materials, Inc. is leading the next technology inflection to advance through-silicon via...

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Software

MES Software suits solar, LED, and chip packaging factories.

Used to track and streamline flow of materials throughout manufacturing facility, SmartFactory(TM) is based on FAB300® MES technology and integrates advanced process control capability. Factory automation solution features pre-built, technology-specific scenarios to monitor every machine and all work-in-progress material movements, manage production sequencing, create audit trail, and...

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Dielectric Deposition System is designed for 3D chip packaging.
Computer Hardware & Peripherals

Dielectric Deposition System is designed for 3D chip packaging.

Applied Producer® InVia(TM) dielectric deposition system uses CVD process to deposit uniform, thick oxide films in greater than 10:1 high aspect ratio (HAR) through-silicon via (TSV) structures. Process also enables electrical isolation of TSV to ensure reliable performance. For 3D packaging schemes, it electrically connects chips that are vertically stacked to boost speed and lower power...

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Wafer Inspection System finds defects in 22 nm devices.
Test & Measurement

Wafer Inspection System finds defects in 22 nm devices.

Applied UVision® 4 enables chipmakers to find defects in critical patterning layers of 22 nm and below logic/memory devices. Product combines DUV laser illumination, programmable polarization, and ultra-sensitive scattered light detectors to achieve optimal inspection sensitivity. Flexible optical system supports wide dynamic range detectors that allow all of chip to be imaged at once....

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PVD System deposits copper barrier for memory chips.

Applied Endura® Extensa(TM) PVD1 is used for depositing critical barrier films for copper interconnects in sub-55 nm memory chips. Its titanium/titanium nitride (Ti/TiN) process technology enables diffusion barrier films with optimal step coverage and less than 3% film thickness non-uniformity across wafer. Dual-magnet PVD source with flux-shaping side electromagnets enables defectivity below...

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Software

Factory Automation Software helps boost fab productivity.

Using scalable software architecture, Applied E3(TM) integrates critical equipment automation and process control components to deliver flexible fab-wide Equipment Engineering System solution. Equipment automation, data collection, and logic handling facilitate construction, deployment, and maintenance of automated process control applications, while fault detection and classification collects...

Read More »
Machinery & Machining Tools

CVD Film extends gap-fill technology to 32 nm and beyond.

Extending HARP SACVD® gap-fill technology for critical STI2 device structures to 32 nm and beyond, Applied Producer® eHARP(TM) system delivers void-free films to fill less than 30 nm, greater than 12:1 aspect ratio features. High-density, strain-inducing films enable scaling of conventional planar and emerging 3D device structures. Virtually carbon-free, eHARP film requires no...

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Agricultural & Farming Products

Etch System for advanced memory interconnects.

Optimized for throughput and MTBC ratings, Applied Producer® Etch system performs interconnect dielectric etch steps needed for production of Flash and DRAM memory chips. Reactor design promotes high-throughput, high-yield dielectric etch in DRAM and NAND Flash interconnect structures from 8X-4X nm technology nodes. System is suited for chip manufacturing applications such as low k...

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CMP Process Controller delivers in-situ endpoint capability.

FullVision(TM) system enables real-time control of dielectric CMP (chemical mechanical planarization) processes to 45 nm device node and beyond. Suited for variety of dielectric materials, including oxide, STI (shallow trench isolation), and poly CMP applications, it couples window-in-pad technology with multiple-wavelength spectroscopy. System demonstrates high repeatability across all...

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Optics & Photonics

SEM offers advanced defect monitoring capabilities.

SEMVision(TM) G4 includes SEM column technology and multi-perspective SEM imaging system that deliver 2 nm physical resolution images at one defect-per-second review rate. It rapidly analyzes and classifies defects as small as 30 nm in most sensitive device layers. Featuring EDXtreme, unit extends chemical characterization of defects to sub-50 nm particle sizes. SEM column can rotate and tilt up...

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Company News

Applied Materials and Singapore's Institute of Microelectronics to Set up Advanced Packaging Center

Singapore, Apr 13, 2011 - Applied Materials, Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, today signed an agreement with the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and Research (A*STAR), to set up a Center of Excellence in Advanced...

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Machinery & Machining Tools

Applied Materials Leads the Way to Enable TSV Interconnects for 3D Chip Stacking

o TSVs are a key driver of 3D chip packaging for future mobile communications devices o Applied introduces latest innovation for TSV production with Producer Avila system o Applied is first to integrate full portfolio of systems for fabricating TSVs in 3D-ICs SEMICON West 2010 SANTA CLARA, Calif.--Applied Materials, Inc. is leading the next technology inflection to advance through-silicon via...

Read More »
Software

MES Software suits solar, LED, and chip packaging factories.

Used to track and streamline flow of materials throughout manufacturing facility, SmartFactory(TM) is based on FAB300® MES technology and integrates advanced process control capability. Factory automation solution features pre-built, technology-specific scenarios to monitor every machine and all work-in-progress material movements, manage production sequencing, create audit trail, and...

Read More »
Dielectric Deposition System is designed for 3D chip packaging.
Computer Hardware & Peripherals

Dielectric Deposition System is designed for 3D chip packaging.

Applied Producer® InVia(TM) dielectric deposition system uses CVD process to deposit uniform, thick oxide films in greater than 10:1 high aspect ratio (HAR) through-silicon via (TSV) structures. Process also enables electrical isolation of TSV to ensure reliable performance. For 3D packaging schemes, it electrically connects chips that are vertically stacked to boost speed and lower power...

Read More »
Wafer Inspection System finds defects in 22 nm devices.
Test & Measurement

Wafer Inspection System finds defects in 22 nm devices.

Applied UVision® 4 enables chipmakers to find defects in critical patterning layers of 22 nm and below logic/memory devices. Product combines DUV laser illumination, programmable polarization, and ultra-sensitive scattered light detectors to achieve optimal inspection sensitivity. Flexible optical system supports wide dynamic range detectors that allow all of chip to be imaged at once....

Read More »

PVD System deposits copper barrier for memory chips.

Applied Endura® Extensa(TM) PVD1 is used for depositing critical barrier films for copper interconnects in sub-55 nm memory chips. Its titanium/titanium nitride (Ti/TiN) process technology enables diffusion barrier films with optimal step coverage and less than 3% film thickness non-uniformity across wafer. Dual-magnet PVD source with flux-shaping side electromagnets enables defectivity below...

Read More »
Software

Factory Automation Software helps boost fab productivity.

Using scalable software architecture, Applied E3(TM) integrates critical equipment automation and process control components to deliver flexible fab-wide Equipment Engineering System solution. Equipment automation, data collection, and logic handling facilitate construction, deployment, and maintenance of automated process control applications, while fault detection and classification collects...

Read More »
Machinery & Machining Tools

CVD Film extends gap-fill technology to 32 nm and beyond.

Extending HARP SACVD® gap-fill technology for critical STI2 device structures to 32 nm and beyond, Applied Producer® eHARP(TM) system delivers void-free films to fill less than 30 nm, greater than 12:1 aspect ratio features. High-density, strain-inducing films enable scaling of conventional planar and emerging 3D device structures. Virtually carbon-free, eHARP film requires no...

Read More »
Agricultural & Farming Products

Etch System for advanced memory interconnects.

Optimized for throughput and MTBC ratings, Applied Producer® Etch system performs interconnect dielectric etch steps needed for production of Flash and DRAM memory chips. Reactor design promotes high-throughput, high-yield dielectric etch in DRAM and NAND Flash interconnect structures from 8X-4X nm technology nodes. System is suited for chip manufacturing applications such as low k...

Read More »

CMP Process Controller delivers in-situ endpoint capability.

FullVision(TM) system enables real-time control of dielectric CMP (chemical mechanical planarization) processes to 45 nm device node and beyond. Suited for variety of dielectric materials, including oxide, STI (shallow trench isolation), and poly CMP applications, it couples window-in-pad technology with multiple-wavelength spectroscopy. System demonstrates high repeatability across all...

Read More »

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