Suss Microtec Inc

Electronic Components & Devices

Environment Friendly Laser Processing in Advanced Packaging Gains Pace - Leading US-American IDM Places Order for Excimer Laser Ablation Tool

Garching - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has received a purchase order for their latest generation laser ablation stepper from a leading US-American IDM (Integrated Device Manufacturer). This important sale re-states the increasing importance of this technology in advanced packaging, adding to the recent shipments...

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Material Processing

Resist Coat, Development Platform supports in-field conversion.

Along with facilitated transfer of processes to MicroTec production tool, RCD8 manual Resist Coat and Develop Platform for substrates can be custom tailored, anywhere and within minutes, from basic manual spin coater to semi-automated GYRSET® enhanced coater and puddle and spray developer tool. Solution is suited for daily R/D work up to small-scale production and covers all necessary...

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Printing & Duplicating Equipment

Lithography System optimizes mask integrity.

Designed to address challenges of mask manufacturing of 193i Optical Immersion and Extreme Ultraviolet Lithography, MaskTrack Pro Bake/Develop brings together ASonic® develop technology with Post-Exposure Bake regime for CD uniformity matching, crucial to sub 22 nm DPT production. Designed to equalize develop rate, independent of feature size and pattern loading, ASonic approach minimizes...

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Construction Equipment and Supplies

Dedicated Lithography System meets LED industry needs.

Used for production of high-brightness light emitting diodes (HB-LEDs), MA100e Gen2 Automatic Mask Aligner processes wafers up to 4 in. and enables throughput of 145 wafers/hr. High-intensity exposure optics and pre-alignment options minimize process time, while functionalities such as proximity exposure for high resolution down to 2.5 Â-µm maximize yield. All together, functionality helps...

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Electronic Components & Devices

Environment Friendly Laser Processing in Advanced Packaging Gains Pace - Leading US-American IDM Places Order for Excimer Laser Ablation Tool

Garching - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has received a purchase order for their latest generation laser ablation stepper from a leading US-American IDM (Integrated Device Manufacturer). This important sale re-states the increasing importance of this technology in advanced packaging, adding to the recent shipments...

Read More »
Material Processing

Resist Coat, Development Platform supports in-field conversion.

Along with facilitated transfer of processes to MicroTec production tool, RCD8 manual Resist Coat and Develop Platform for substrates can be custom tailored, anywhere and within minutes, from basic manual spin coater to semi-automated GYRSET® enhanced coater and puddle and spray developer tool. Solution is suited for daily R/D work up to small-scale production and covers all necessary...

Read More »
Printing & Duplicating Equipment

Lithography System optimizes mask integrity.

Designed to address challenges of mask manufacturing of 193i Optical Immersion and Extreme Ultraviolet Lithography, MaskTrack Pro Bake/Develop brings together ASonic® develop technology with Post-Exposure Bake regime for CD uniformity matching, crucial to sub 22 nm DPT production. Designed to equalize develop rate, independent of feature size and pattern loading, ASonic approach minimizes...

Read More »
Construction Equipment and Supplies

Dedicated Lithography System meets LED industry needs.

Used for production of high-brightness light emitting diodes (HB-LEDs), MA100e Gen2 Automatic Mask Aligner processes wafers up to 4 in. and enables throughput of 145 wafers/hr. High-intensity exposure optics and pre-alignment options minimize process time, while functionalities such as proximity exposure for high resolution down to 2.5 Â-µm maximize yield. All together, functionality helps...

Read More »

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