Universal Instruments Corp.
Binghamton, NY 13902-0825
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Chip Placement System offers rates up to 57,000 cph.
Combining 2 placement heads on platform machine, Genesis-Lightning chip placement system places devices such as CSP, WSP, uBGA, and Melfs. Lightning heads address components from 01005s to 30 x 30 mm. Other features include large board capability, dual lane manufacturing functionality, and proprietary dual linear drive positioning.
Read More »Placement Machine offers 100 ppm performance.
Featuring built-in turret technology, 4-gantry Quadris-S(TM) combines 80,000 cph placement performance, size 0201 to 44 x 44 mm component range, and support for tape and tray feeders. It provides motion controls and productivity optimizers such as automatic board centering between feeder banks and on-the-fly gang recognition. Fine pitch capabilities support BGA or leaded packages of 0.5 mm pitch....
Read More »Placement Platforms address various assembly tasks.
Platform AC-30L utilizes rotary Lightning head with radial array of 30 modular, individually controlled spindles. It drives placement rates up to 30,000 cph and addresses component range from 0201s to 30 x 30 mm. Multi-Function AX-72 deploys up to 2 heads on one beam, offering combination head capability. Component range is from 0201s to 55 x 55 mm devices at placement rates to 16,500 cph. It...
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Software facilitates new product introduction.
Used with AdVantis and GSM Genesis platform-based machines, NPI Software enables error correction ahead of first article build, with post-placement inspection to facilitate fine-tuning and troubleshooting. Feeder inspection mode uses machine's downward looking cameras to inspect each feeder prior to commencing first article build. After board enters machine, NPI fiducial find function allows...
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Placement Machine delivers high-volume chip placement.
Quadris(TM) hybrid quad-beam SMT chip-placement system, configured with Lightning(TM) heads and turret-style HSP, achieves 62,000 cph placement speed due to integration of dual-drive linear motors. Features include automatic placement-height optimization, Productivity Shift(TM) board transfer system, on-the-fly gang recognition, and bank feeder change and splicing capabilities.
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Placement Machine suits flip chip industry.
Featuring single-beam positioning system, AdVantis(TM) AFC-42 employs dual-drive lead screws as well as 1 -µm linear encoders. It includes high-magnification cameras, flip chip algorithms, low force capability, heated spindles, fluxing, and several feeder types. Up-front configurability and future scalability make machine suited for high-mix and high-volume manufacturers.
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Wafer Feeder offers on-line wafer expander option.
Wafer Feeder is compatible with industry-standard wafer sizes, including 12, 8, and 6 in., and accepts full 25-wafer cassettes. It combines programmable die ejection, theta correction and expansion with wafer mapping and ink dot recognition, bar code identification, and tracking of wafers to handle complex dies in 300 mm format. Use of parallel processing has pared tact time as low as 1 sec/ die....
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Placement Machine offers placement rates to 54,000 cph.
Platform-based Genesis Lightning features dual heads, each with radial array of 30 modular, individually controlled spindles. Each plug-in spindle module contains tiny venturi vacuum generator to maintain very short vacuum path. Dual on-the-head optics allow machine to address components from 01005 to 30 x 30 mm. Machine supports component preorientation as well as on-the-head rejection for small...
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Placement Machine offers speeds of up to 48,000 cph.
Model 4797R HSP measures 3,100 x 2,155 mm and can handle boards up to 610 mm x 460 mm. It includes twelve 5-spindle, direct-drive placement heads and UCT53 software for offline programming. Three-sigma accuracy is 0.08 mm for MELFs and small chips, and 0.05 mm for leaded components. Machine accepts up to 72 unique components on standard 8 mm tape feeders, or 96 unique components with dual-track...
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