Universal Instruments Corp.
Binghamton, NY 13902-0825
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Universal to Present Leading-edge Placement Technology at Mexitronica 2006
Universal Instruments has announced plans to showcase the highly flexible AdVantis AX-72 and Quadris-S machine sets from booth #718 at this year's Mexitronica, being held over October 10th - 12th in Guadalajara, Mexico. An example of the AdVantis Platform's inherent flexibility, Universal's AdVantis AX-72 display will highlight one of the most adaptable models in the AdVantis collection. A...
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Tape Feeders suit high-speed chip placement equipment.
Including PSV sensor that notifies machine and line software when component reels are serviced by operator, High-Performance Gold Feeders support line-level reporting and traceability functionality. They offer continuous splice capability and high speed chip component presentation. Single lane 8 and 12 mm feeders have features for precise and repeatable feeder registration, while 16, 24, and 32...
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Universal Instruments to Showcase AdVantis Platform at ATExpo 2006
Universal Instruments has unveiled plans to showcase its popular AdVantis placement platform from booth #5842 at this year's Assembly Technology Expo, taking place over September 26th - 28th in Chicago, US. The Universal display will highlight AdVantis' ability to blend high-end machine productivity and operator flexibility for a value-driven performance. Equipped to respond to a variety of...
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Universal Instruments Enhances Package-on-Package Flexibility
In response to rising demand for Package-on-Package (PoP) applications, Universal has developed new hardware and process technology to accommodate effective flux dipping and soldering for enhanced manufacturing flexibility. Demand for PoP technology is certainly growing, rendering continual innovation in hardware and process technology absolutely vital for successful implementation industry-wide,...
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AdVantis Platforms at SMT Nuremberg
Universal Instruments is showing two AdVantis(TM) placement platform models at SMT Nuremberg on Booth #7-449. The company's platform product portfolio now includes a broad range of AdVantis models specifically configured to address a variety of assembly tasks while still offering maximum flexibility, modularity and excellent value. On display at SMT Nuremberg are the AdVantis AC-30L model, a high...
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Universal Instruments AdVantis-Lightning Chip Placement Solution on Display at NEPCON
At Nepcon 2006 Universal Instruments will be displaying the AdVantis Lightning, a high speed modular system featuring Universal's acclaimed Lightning head. The AdVantis Lightning Platform combines the throughput of Universal's revolutionary rotary Lightning head with the flexibility and value driven performance of the acclaimed AdVantis platform. With its ability to deliver high utilization for...
Read More »Universal Instruments at Productronica 2005
Industry-leading component placement specialist Universal Instruments will use Productronica 2005 to showcase its innovative Lightning(TM) rotary placement head - an enabling technology that makes all-platform lines a reality for medium to high volume assembly applications. The Lightning head features 30 independently-controlled spindles with touchdown sense, auto Z update at pickup, and board...
Read More »Chip Placement System offers rates up to 57,000 cph.
Combining 2 placement heads on platform machine, Genesis-Lightning chip placement system places devices such as CSP, WSP, uBGA, and Melfs. Lightning heads address components from 01005s to 30 x 30 mm. Other features include large board capability, dual lane manufacturing functionality, and proprietary dual linear drive positioning.
Read More »Placement Machine offers 100 ppm performance.
Featuring built-in turret technology, 4-gantry Quadris-S(TM) combines 80,000 cph placement performance, size 0201 to 44 x 44 mm component range, and support for tape and tray feeders. It provides motion controls and productivity optimizers such as automatic board centering between feeder banks and on-the-fly gang recognition. Fine pitch capabilities support BGA or leaded packages of 0.5 mm pitch....
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