Dek U.S.A., Inc.

Electrical Equipment & Systems

DEK Launches Eclipse at EU PVSEC 2010; Showcases Unprecedented PV Production Flexibility

DEK Solar is preparing to launch its highly anticipated Eclipse platform at this year's EU PVSEC exhibition, being held in Valencia from 6th - 10th September. On stand B14 in Hall L2/H4, the DEK Solar team will introduce visitors to the advanced metallization line's unprecedented flexibility. Senior Process Development Specialist, Tom Falcon, will also be presenting the company's latest...

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Enclosed Head Print System uses performance-optimized technology.
Printing & Duplicating Equipment

Enclosed Head Print System uses performance-optimized technology.

Able to accommodate all solder pastes to meet flexibility requirements of demanding production environments, ProFlow® ATx combines low-volume print chamber with paste loading mechanism to promote consistent process control and performance. Within print chamber, conditioning grid actively conditions solder paste materials, and system subsequently delivers paste roll for precise aperture filling....

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DEK Solar Prepares to Showcase Pioneering PV3000 at AsiaSolar Energy Photovoltaic Exhibition and Forum
Printing & Duplicating Equipment

DEK Solar Prepares to Showcase Pioneering PV3000 at AsiaSolar Energy Photovoltaic Exhibition and Forum

DEK Solar will be bringing its newly-introduced PV3000 metallization line to this year's AsiaSolar Energy Photovoltaic Exhibition and Forum, being held at Shanghai Mart from 30th March - 1st April. In addition to providing an opportunity for visitors to see the line in action, the exhibition will also enable attendees to find out more about the company's innovative approach to service and...

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Double Layer Stencil combines filling, inner-layer stages.
Electronic Components & Devices

Double Layer Stencil combines filling, inner-layer stages.

Suited for semiconductor applications and component manufacture, VectorGuard® Double Layer Platinum stencil is fabricated through 2-step lithography and Nickel electroforming process before mounted on VectorGuard tensioning technology. Mesh layer holds stencil intact while controlling flow of paste to second layer, and circuit layer determines thickness and shape of print deposits to deliver...

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DEK Customers Can Expect More with New Substrate Clamping Technology
Printing & Duplicating Equipment

DEK Customers Can Expect More with New Substrate Clamping Technology

DEK has announced the launch of its new Over Top Snuggers (OTS) substrate clamping technology. Securing printed circuit boards firmly in place ready for processing, the flexible technology is designed to ensure high quality printing for enhanced end-of-line yield. OTS from DEK is a sophisticated device that clamps the board flat before enabling finite snugging and clamp control for precise board...

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PCB Inspection System operates at 36,000 mm²/sec.
Printing & Duplicating Equipment

PCB Inspection System operates at 36,000 mm²/sec.

Deploying inspection technology based on HawkEye® post-print inspection tool, Sentinel allows printing and high-speed inspection to run concurrently. System is controlled by Instinctiv V9 user interface and provides paste on pad, bridge detection, and alignment capabilities. Closed loop control handles alignment, automatic understencil cleaning, and paste dispensing. With Sentinel, board and pad...

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High-Speed System advances microsphere capability.
Machinery & Machining Tools

High-Speed System advances microsphere capability.

Able to achieve accuracy and precision at first pass yield of over 99.99%, DirEKt Ball Placement(TM) process enables accurate solder sphere deposition for spheres as small as 200 -µm dia with pitches as tight as 300 -µm. Parallel print process allows for repeatable accuracy and accelerated cycle times independent of I/O count. Consistent with requirements for next-generation wafer-level CSP...

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DEK Honors Continuing Education Commitment, Donates Printing System to Cal Poly
Printing & Duplicating Equipment

DEK Honors Continuing Education Commitment, Donates Printing System to Cal Poly

Upholding its pledge to support educational advance that promotes electronics innovation, DEK announces that it has donated a Horizon 03i printing system to California Polytechnic State University (Cal Poly), San Luis Obispo, further enabling the institution's learn by doing approach. As the finishing touch on the university's complete surface mount assembly line, the DEK Horizon 03i will be used...

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Agricultural & Farming Products

Monitor detects level of solder paste for process control.

Paste Roll Height Monitor features lasers to detect presence of solder paste and Instinctiv® V9 user interface to simplify setup. Unit includes 2 sensors that sit on either side of squeegee blade framework support. Light curtain detects solder paste presence or absence and device sends signal to printer, which reads conditions as normal when paste breaks light beam. Automatic paste dispenser...

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Wafer Coating Technology optimizes speed, productivity.
Material Processing

Wafer Coating Technology optimizes speed, productivity.

With Cp greater than 2@±12.5 -µm and 7 -µm Total Thickness Variation, process capability of its DirEKt Coat(TM) wafer coating technology effectively addresses needs of current and future thinned wafer products. Backside coating technique, capable of depositing 25 -µm thick coatings onto wafers as thin as 150 -µm, promotes accelerated processing times and optimizes chip footprints. Parallel...

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