Dek U.S.A., Inc.

Global Technology Awards Honour DEK's Breakthrough Instinctiv(TM) Technology
Software

Global Technology Awards Honour DEK's Breakthrough Instinctiv(TM) Technology

DEK has won a Global Technology Award for its Instinctiv machine user interface. The trophy was presented to the mass imaging specialist at a ceremony held on September 27th at Chicago's ATExpo 2006. Sponsored by Global SMT & Packaging Magazine, the awards were designed to recognise the best new product innovations released over the past year. Instinctiv won the software category after the panel...

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Test & Measurement

DEK to Demonstrate High-Speed, 100% Post-Print Verification at ATExpo 2006

With an official introduction to the marketplace only a short time ago, DEK's HawkEye(TM) post-print verification system is fast becoming one of the industry's premiere tools for throughput enhancement and 100% line-beat rate print inspection. This latest advancement from the leader in mass imaging will be on display in booth #5400 at the upcoming ATExpo, scheduled to take place in Rosemont,...

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Machinery & Machining Tools

Tool Package accelerates 25 micron backside wafer coating.

Equipment and tooling package enables coating of wafers with die attach materials down to 25 microns thick. It eliminates limitations on chip footprint due to chip fillet formation and resin bleed while allowing uniform deposition of materials with tolerances of ±7 microns using flexible screen printing platform. Solution utilizes Micron-class Galaxy mass imaging system, ultra-flat pallet, die...

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Machinery & Machining Tools

High Accuracy Mass Imaging Takes Center Stage at Semicon West 2006

DEK's Micron-class Platform to Demonstrate DirEKt Ball Place(TM) Sphere Placement Capability As leading packaging firms search for flexible, higher throughput manufacturing solutions to meet emerging speed and accuracy requirements, DEK continues to answer the call with innovative process technology enabled by its versatile Micron-class printing platform. Visitors to DEK's booth at the upcoming...

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Materials

Experiments Show Lead-free Pastes will give Great Results with 0201s

DEK has concluded research into screen printing for 0201 SMT components using SnPb and SAC solder pastes, highlighting new assembly and board design parameters for robust, high-volume assembly with minimal application-specific modifications. Among the observations from analyzing a large number of test assemblies post reflow, DEK found that SAC pastes have an inherently wider process window....

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Printing & Duplicating Equipment

DEK's Flexible Horizon Platform and Total Process Solutions on Display at Canadian High Tech Show

Visitors to this year's Canadian High Tech Show in Toronto, Canada will see first hand how DEK's award-winning products and total process solutions philosophy are cost-effectively enabling next-generation manufacturing through high accuracy mass imaging creativity. At the upcoming event, DEK will showcase its flexible Horizon 03i screen printing platform. An unbeatable combination of performance...

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Stencils facilitate high-speed adhesive deposition.
Labels Tags Signage & Equipment

Stencils facilitate high-speed adhesive deposition.

Available in 23 x 23 and 29 x 29 in. sizes with 3 mm thickness, VectorGuard(TM) PumpPrint(TM) Stencils utilize tensioning system of VectorGuard frame, which attaches directly to acrylic PumpPrint stencils by engaging in channel routed around circumference. Stencils allow large numbers of adhesives deposits of almost any shape and size to be made on populated PCBs with sub 8 second cycle times.

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Machinery & Machining Tools

Tooling Pins exert 5 g of pressure during lift.

Grid-Lok(TM) features modular array of pneumatically controlled tooling pins that conform to underside of board including contact with components. They are tipped with anti-static material, and locked independently. Conforming sequence is initiated by operator, or alternatively, in fully automatic mode, system can set profile for every product that passes through machine. Grid-Lok arrays work...

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