Master Bond, Inc.

Adhesive offers high thermal conductivity.
Adhesives & Sealants

Adhesive offers high thermal conductivity.

Two-component, room temperature curing EP21ANHT features thermal conductivity of over 22BTU/in/ftÂ-²/hr/°F. It comes in paste form and offers high bond strength to wide variety of substrates. Bonds resist water, oil, fuels, and many solvents. Shore D hardness is >85 and volume resistivity is >1013 ohm-cm. Cures can be accelerated by use of heat. EP21ANHT is recommended for high...

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High Temperature Resistant Epoxy is chemical-resistant.
Adhesives & Sealants

High Temperature Resistant Epoxy is chemical-resistant.

EP125 two component epoxy system, suited for service above 500°F, withstands exposure to boiling acids, alkalis, salts, fuels, and organic solvents. Able to bond to metallic and nonmetallic surfaces, product offers typical lap shear strengths of 2,400-2,500 psi at ambient temperatures. Castings exhibit flexural strength as high as 15,000 psi and flexural moduli of more than 500,000 psi....

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Epoxy meets NASA outgassing requirements.

Epoxy meets NASA outgassing requirements.

Supreme10HT/S silver-filled one-component epoxy compound offers service temperature range from cryogenic temperatures up to 400°F. It is electrically conductive and provides chemical resistance and durability, even when exposed to severe environments. Cure is effected by heating at 250°F for approximately 1 hr or 300°F for 30 min. Lap shear strengths exceed 1800 psi. Supreme...

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Epoxy Adhesive is suitable for use in high temperatures.
Adhesives & Sealants

Epoxy Adhesive is suitable for use in high temperatures.

Two component, high temperature resistant epoxy adhesive, EP35, cures at room temperature. Bonds are maintained after long exposures to temperatures of 450-500°F. With 100 to 70 mix ratio by weight, product can be applied without sagging or dripping. Bond is resistant to thermal cycling and chemicals. Service operating temperature range is -60°F to 500°F, and material adheres to...

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Epoxy System is resistant to chlorinated organic solvents.
Paints & Coatings

Epoxy System is resistant to chlorinated organic solvents.

Master Bond Polymer System EP41S-5, two component epoxy resin composition provides chemical resistance to aggressive media such as fuels and strong oxidizing acids. Resistance is maintained after prolonged exposures without deterioration of pertinent performance properties. Offered in various viscosities, it cures at room or elevated temperatures and has 4 to 1 mix ratio, weight or volume....

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Aluminum-Filled Epoxy cures at room temperature.
Adhesives & Sealants

Aluminum-Filled Epoxy cures at room temperature.

Type EP22 2-component epoxy adhesive features 1:1 mix ratio by weight or volume. It produces high strength bonds with adhesion to metals, particularly steel and aluminum. Bonds are resistant to thermal cycling and chemicals. Epoxy is readily machinable and can be employed over temperature range of -60 to 250°F. Shrinkage upon cure is low and dimensional stability is high. Cure can be...

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Instant Adhesive resists shock and vibration.
Adhesives & Sealants

Instant Adhesive resists shock and vibration.

MB297FL single component cyanoacrylate adhesive has operating temperature range of -65 to +185°F and bonds to metals, ceramics, plastics, and elastomers. It adheres to assemblies whose substrates have different expansion coefficients. Cured adhesive has excellent optical clarity and is resistant to many chemicals. It is available in 1/3 oz, 1 oz, and 1 lb bottles.

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Adhesive/Sealant has service range of -75 to 500°F.
Adhesives & Sealants

Adhesive/Sealant has service range of -75 to 500°F.

Polymer System X5HT one component, contact type adhesive/sealant offers dimensional stability and creep- and chemical-resistance. Curing process requires application to each substrate, application of pressure (less than 50 psi), and curing at 300 to 400°F for 15 to 30 min in vented oven. X5HT adheres to metals, polymers, composites, glass, and ceramics. Lap shear strength values range from...

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Epoxy System is approved for NASA outgassing specifications.
Adhesives & Sealants

Epoxy System is approved for NASA outgassing specifications.

With 10:1 mix ratio by weight, EP30LTE-LO room temperature curing epoxy system has CTE of 12 x 10-6 in./in. per °C. Linear shrinkage is rated at 0.0002 in./in. per °C, thermal conductivity is 6 BTUoin./ftÂ-²ohro°F, and service temperature ranges from -60 to +250°F. Able to bond to various metals, plastics, ceramics, and glass, EP30LTE-LO passes ASTM 595 for low...

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Epoxy Adhesive is graphite filled and electrically conductive.
Adhesives & Sealants

Epoxy Adhesive is graphite filled and electrically conductive.

Two-component EP75-1 has 100 to 15 mix ratio by weight. It cures at room temperature or more rapidly at elevated temperatures. Adhesive develops bonding strength of more than 2,000 psi tensile shear when measured and cured at 75°F. Volume resistivity of cured system is 50-100 ohm cm. Adhesive contains no solvents or diluents. It is suitable for metals, glass, ceramics, vulcanized rubber,...

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