Master Bond, Inc.

Epoxy Adhesive suits cryogenic applications.
Adhesives & Sealants

Epoxy Adhesive suits cryogenic applications.

Two-component, EP51FL epoxy resin system features 1:1 mix ratio, cures rapidly at room temperature, and has setup time of 30-40 min. Product is 100% reactive and emits no solvents or volatiles during cure. It bonds to metals, glass, ceramics, wood, various rubbers, and most plastics. Cured compound exhibits peel strength of more than 25 pli along with elongation of greater than 125%. Offering...

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Silicone Compound is electrically conductive.
Adhesives & Sealants

Silicone Compound is electrically conductive.

Suited for bonding and sealing applications, 2-component, graphite-filled Master Sil 155 has 1:1 mix ratio by weight and cures at ambient temperatures or with heat. Controlled viscosity of silicone elastomer formulation produces smooth paste for complete fill-in around complicated contours. Compound exhibits elongation greater than 300%, resistance to shock and vibration, and less than 0.15%...

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Epoxy adheres to glass, polycarbonates, and acrylics.
Adhesives & Sealants

Epoxy adheres to glass, polycarbonates, and acrylics.

Suited for bonding, sealing, coating, encapsulation, and casting, EP30P transparent, 2-component epoxy system cures at room temperature, which can be accelerated by use of heat. Electrically insulating, 100% reactive system contains no solvents or diluents and exhibits minimal linear shrinkage upon cure. With tensile strength that exceeds 9,500 psi, product has mixed viscosity of 1,200-1,400 cps...

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Epoxy provides high thermal conductivity.
Adhesives & Sealants

Epoxy provides high thermal conductivity.

Type EP34AN room temperature cure, 2-component epoxy adhesive/sealant, with thermal conductivity of 22-24 BTU/in/ftÂ-²/hr/°F, maintains physical properties after prolonged exposure to temperatures from 400-450°F. It exhibits dimensional stability and electrical insulation properties and can be applied without sagging or dripping. Able to bond to various substrates, 100% reactive...

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Epoxy Compound withstands exposure to thermal cycling.
Adhesives & Sealants

Epoxy Compound withstands exposure to thermal cycling.

EP30FL Epoxy Potting and Encapsulation compound has low viscosity and can be used in both thick and thin cross sections. Generating low exotherm during cure, it cures at room temperature with low shrinkage. Electrically insulated compound adheres to both similar and dissimilar substrates, is 100% reactive, does not contain any volatiles, and withstands mechanical shock and vibration.

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Room Temperature Curing Epoxy withstands sterilization.
Adhesives & Sealants

Room Temperature Curing Epoxy withstands sterilization.

Dual-component EP42HT-2 epoxy adhesive, sealant, coating, and casting material withstands repeated sterilizations, including radiation, ethylene oxide, chemical sterilants, and steam. Featuring service operating temperature range of -60 to +450°F, product exhibits chemical resistance and Shore D hardness greater than 75. Properties include mixed viscosity of 3,500 cps and tensile strength...

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Epoxy Adhesive/Sealant resists temperatures up to 600°F.
Adhesives & Sealants

Epoxy Adhesive/Sealant resists temperatures up to 600°F.

One-component, heat-curing, EP17 offers service operating range of -300 to +600°F and cures in 60-90 min at 300-350°F. Product bonds to metals, glass, ceramics, vulcanized rubbers, and plastics. Chemical-resistant EP17 has Shore D hardness greater than 90, compressive strength greater than 13,000 psi, and tensile strength of 8,700 psi. Flowable paste is 100% reactive, does not contain...

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Potting/Encapsulation Compound resists thermal shock.
Adhesives & Sealants

Potting/Encapsulation Compound resists thermal shock.

Two-component, epoxy-sealing EP110F6, for potting, encapsulation, and casting, has 1-2 mix ratio by weight and cures upon exposure to elevated temperatures. It provides electrical insulation and resists thermal cycling and shock. Medium-viscosity liquid passes Navy Hex Bar Test, MILI-16923C, consisting of 10 cycles from -55 to +155°C. It resists chemicals and adheres to wide range of...

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Epoxy Adhesive contains no volatiles or solvents.
Adhesives & Sealants

Epoxy Adhesive contains no volatiles or solvents.

Two-component EP24 cures at room temperature or more rapidly at elevated temperatures. It will also cure at colder temperatures, down to 20°F. With mix ratio of 1:1, adhesive is 100% reactive and resistant to thermal cycling and chemicals. It develops high bonding strength of more than 3,000 psi at room temperature and is suited for metals, glass, ceramics, wood, vulcanized rubbers, and...

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Adhesive resists exposure to repeated sterilization.
Adhesives & Sealants

Adhesive resists exposure to repeated sterilization.

EP45HTMed 2-component, heat-cured epoxy adhesive withstands long-term exposure from -80 to +500°F and has glass transition temperature of greater than 185°C. It adheres to various materials and withstands exposure to repeated cycles of radiation, steam, and chemical sterilants. Cured system acts as electrical insulator and is formulated for use in assembly of reusable medical devices....

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