Master Bond, Inc.
Hackensack, NJ 07601-3950
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications
Well suited for use in vacuum environments, Master Bond MasterSil 973S-LO is an adhesive, sealant and coating that passes NASA low outgassing tests. This electrically conductive, two component silicone can be used in the aerospace, electronic, opto-electronic and specialty OEM industries. Featuring a low volume resistivity of 0.004 ohm-cm, MasterSil 973S-LO is a silver filled compound that has a...
Read More »Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission
Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically clear with a refractive index of 1.55. It also passes ASTM E595 testing to meet NASA low outgassing specifications. Beyond its optical properties, EP30-2LB is a reliable structural adhesive with a tensile...
Read More »Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission
Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically clear with a refractive index of 1.55. It also passes ASTM E595 testing to meet NASA low outgassing specifications. Beyond its optical properties, EP30-2LB is a reliable structural adhesive with a tensile...
Read More »Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications
Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well...
Read More »Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications
Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well...
Read More »Conductive Adhesive/Sealant passes NASA low outgassing tests.
Effective for grounding, shielding, and static dissipation, EP21TDCN-LO electrically conductive, 2-component adhesive/sealant features- nickel filler and passes ASTM E595 tests for NASA low outgassing. Chemical-resistant product bonds to similar and dissimilar substrates. Along with 5-10 ohm-cm resistivity and 11 BTU•in/ft²•hr•Â°F thermal conductivity, properties include respective...
Read More »Conductive Adhesive/Sealant passes NASA low outgassing tests.
Effective for grounding, shielding, and static dissipation, EP21TDCN-LO electrically conductive, 2-component adhesive/sealant features- nickel filler and passes ASTM E595 tests for NASA low outgassing. Chemical-resistant product bonds to similar and dissimilar substrates. Along with 5-10 ohm-cm resistivity and 11 BTU•in/ft²•hr•Â°F thermal conductivity, properties include respective...
Read More »No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications
Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K) and a volume resistivity...
Read More »No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications
Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•-°F [1.30-1.44 W/(m·K) and a volume resistivity...
Read More »Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications
Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with...
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