Master Bond, Inc.

UV Curable Adhesive targets medical device manufacturing.
Adhesives & Sealants

UV Curable Adhesive targets medical device manufacturing.

Adhering to metals, glass, ceramics, and most plastics, optically clear UV10MED is USP Class VI approved, resistant to chemicals and sterilants, and has service operating temperature of -60 to 250°F. Product is 100% reactive and does not contain any solvents or other volatiles. Curing in 5-10 sec with UV lamp and 2-3 min at ambient temperatures, UV10MED offers tensile strength greater than...

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Epoxy Adhesive is suited for cryogenic applications.
Adhesives & Sealants

Epoxy Adhesive is suited for cryogenic applications.

With mix ratio of 100:65 by weight, EP29LPSP can withstand temperatures to 4 K, and resist cryogenic shocks (room temperature down to liquid helium temperatures in 5-10 min time period). It cures at room temperatures, and can be heat cured at 130-165°F for 6-8 hr. Chemical resistant adhesive features mixed viscosity of 400 cps, tensile strength of 6,500 psi, tensile modulus of greater than...

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Epoxy Resin System passes NASA's low outgassing test.
Adhesives & Sealants

Epoxy Resin System passes NASA's low outgassing test.

With ability to withstand temperatures up to 500°F, 2-component optically clear EP121CL cures to tough solid with chemical resistance even when exposed to adverse environmental conditions. It features 12,100 psi tensile strength, 17,200 psi compressive strength, volume resistivity greater than 3 x 1,014 ohmW cm, dissipation factor of 0.020 at 1 MHz, and dielectric constant of 3.34 at 60 Hz....

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Epoxy Resin offers dimensional stability.
Adhesives & Sealants

Epoxy Resin offers dimensional stability.

Suited for bonding, encapsulation, and coating, 2-component EP21LM-3 develops tensile modulus greater than 100,000 psi and tensile shear strength greater than 2,300 psi. Viscosity of 37,000 cps enables product to flow evenly and smoothly without application of pressure. When cured, polymer has Shore D hardness of 64 and resists thermal cycling as well as water, oil, fuels, and most organic...

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Epoxy Resin resists temperatures up to 500°F.
Adhesives & Sealants

Epoxy Resin resists temperatures up to 500°F.

Designed for use in high performance composite structures and potting/casting applications, polyfunctional epoxy resin EP34CA can be combined with hardeners to provide low viscosity liquid which is suited for filament windings. Mechanical properties vs. time/temperature of unidirectional graphite composites based on Modmore Type II T fiber and matrix of EP34CA/EP34C yield flexural strength of...

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Polymer System cures by UV light and/or heat.
Adhesives & Sealants

Polymer System cures by UV light and/or heat.

One component, optically clear, non-yellowing UV15-7DC is designed for bonding, sealing, and coating applications. Cure times range from 5 sec to 2-3 min depending upon wave length, intensity of UV light, and thickness being cured. Heat curing schedules are 10-30 min at 250-260°F. System adheres to glass, metals, plastics, polyester films, and polycarbonates, and exhibits Shore D hardness...

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Silicone Potting Compound assures complete fill-in.
Adhesives & Sealants

Silicone Potting Compound assures complete fill-in.

Suitable for casting, potting, and encapsulation, 2-component MasterSil 151 cures at room temperature or more rapidly at elevated temperatures. It features elongation at break of 160%, Shore A hardness of 45, and dielectric strength of 460 V/mil. Optically clear product offers resistance to vibration, impact, shock, and thermal cycling. With service operating temperature range of -65 to...

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Potting Compound has flexible, low-viscosity formulation.
Adhesives & Sealants

Potting Compound has flexible, low-viscosity formulation.

Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound...

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Conductive Adhesive withstands severe conditions.
Adhesives & Sealants

Conductive Adhesive withstands severe conditions.

Adhering to metallic and nonmetallic substrates, Epoxy Type EP11SIC is supplied as silver colored flowable paste with tensile strength greater than 6,000 psi and tensile shear strength over 1,500 psi over temperature range of -60 to +300°F. Gel time at 300°F is 20-25 min while cure is 40-50 min at 347°F. Performance properties include volume resistivity less than 0.001 ohm-cm,...

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Two-Component Epoxy Adhesive gels in 3 minutes.
Adhesives & Sealants

Two-Component Epoxy Adhesive gels in 3 minutes.

Used in general-purpose bonding applications or as electrical insulator, Polymer Adhesive EP44 gels in 3 min and cures within a few hours at ambient temperatures to develop bonding shear strength of 3,150+ psi. Parts bonded with this solution can be safely handled within 30 min, and bonds are resistant to thermal cycling as well as chemicals over -60 to 250°F range. Product adheres to...

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