Master Bond, Inc.

Adhesives & Sealants

Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications

Well suited for use in vacuum environments, Master Bond MasterSil 973S-LO is an adhesive, sealant and coating that passes NASA low outgassing tests. This electrically conductive, two component silicone can be used in the aerospace, electronic, opto-electronic and specialty OEM industries. Featuring a low volume resistivity of 0.004 ohm-cm, MasterSil 973S-LO is a silver filled compound that has a...

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Adhesives & Sealants

Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission

Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically clear with a refractive index of 1.55. It also passes ASTM E595 testing to meet NASA low outgassing specifications. Beyond its optical properties, EP30-2LB is a reliable structural adhesive with a tensile...

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Adhesives & Sealants

Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission

Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically clear with a refractive index of 1.55. It also passes ASTM E595 testing to meet NASA low outgassing specifications. Beyond its optical properties, EP30-2LB is a reliable structural adhesive with a tensile...

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Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications
Adhesives & Sealants

Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications

Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well...

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Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications
Adhesives & Sealants

Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications

Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well...

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Conductive Adhesive/Sealant passes NASA low outgassing tests.
Adhesives & Sealants

Conductive Adhesive/Sealant passes NASA low outgassing tests.

Effective for grounding, shielding, and static dissipation, EP21TDCN-LO electrically conductive, 2-component adhesive/sealant features- nickel filler and passes ASTM E595 tests for NASA low outgassing. Chemical-resistant product bonds to similar and dissimilar substrates. Along with 5-10 ohm-cm resistivity and 11 BTU•in/ft²•hr•Â°F thermal conductivity, properties include respective...

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Conductive Adhesive/Sealant passes NASA low outgassing tests.
Adhesives & Sealants

Conductive Adhesive/Sealant passes NASA low outgassing tests.

Effective for grounding, shielding, and static dissipation, EP21TDCN-LO electrically conductive, 2-component adhesive/sealant features- nickel filler and passes ASTM E595 tests for NASA low outgassing. Chemical-resistant product bonds to similar and dissimilar substrates. Along with 5-10 ohm-cm resistivity and 11 BTU•in/ft²•hr•Â°F thermal conductivity, properties include respective...

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Adhesives & Sealants

No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K) and a volume resistivity...

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Adhesives & Sealants

No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•-°F [1.30-1.44 W/(m·K) and a volume resistivity...

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Adhesives & Sealants

Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications

Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with...

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