Rudolph Technologies, Inc.

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Printing & Duplicating Equipment

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging

Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...

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Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Printing & Duplicating Equipment

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging

Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...

Read More »
New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Printing & Duplicating Equipment

New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats

Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.

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New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Printing & Duplicating Equipment

New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats

Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.

Read More »
Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection
Test & Measurement

Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection

One quarter after release, the new Dragonfly platform achieves market recognition in advanced macro inspection with multiple deliveries to world’s largest OSAT Wilmington, Mass. (January 8, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the product. Several systems were delivered in...

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Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection
Test & Measurement

Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection

One quarter after release, the new Dragonfly platform achieves market recognition in advanced macro inspection with multiple deliveries to world’s largest OSAT Wilmington, Mass. (January 8, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the product. Several systems were delivered in...

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Latest NovusEdge Inspection System Uses Multiple Cameras
Test & Measurement

Latest NovusEdge Inspection System Uses Multiple Cameras

The NovusEdge™ System is designed for edge, notch and backside inspection of unpatterned wafers. The system is offered with multiple cameras, advanced technologies for delivering composite image of the entire wafer bevel. The device uses sophisticated analytical routines for identifying and classifying defects as small as the sub-micron level. It utilizes high-speed laser-scanning to detect...

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Latest NovusEdge Inspection System Uses Multiple Cameras
Test & Measurement

Latest NovusEdge Inspection System Uses Multiple Cameras

The NovusEdge™ System is designed for edge, notch and backside inspection of unpatterned wafers. The system is offered with multiple cameras, advanced technologies for delivering composite image of the entire wafer bevel. The device uses sophisticated analytical routines for identifying and classifying defects as small as the sub-micron level. It utilizes high-speed laser-scanning to detect...

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New Dragonfly Inspection and Metrology System from Rudolph Comes with Clearfind Technology
Test & Measurement

New Dragonfly Inspection and Metrology System from Rudolph Comes with Clearfind Technology

The Dragonfly™ G2 Inspection and Metrology System is offered with multiple sensor options and benefits of the Firefly™ system. This system enables packaging customers to meet the wafer-based application challenges. The unit is embedded with proprietary camera technology and supports Truebump™ Technology for non-visual residue detection. It comes with streamlined software algorithms for...

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New Dragonfly Inspection and Metrology System from Rudolph Comes with Clearfind Technology
Test & Measurement

New Dragonfly Inspection and Metrology System from Rudolph Comes with Clearfind Technology

The Dragonfly™ G2 Inspection and Metrology System is offered with multiple sensor options and benefits of the Firefly™ system. This system enables packaging customers to meet the wafer-based application challenges. The unit is embedded with proprietary camera technology and supports Truebump™ Technology for non-visual residue detection. It comes with streamlined software algorithms for...

Read More »
Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Printing & Duplicating Equipment

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging

Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...

Read More »
Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Printing & Duplicating Equipment

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging

Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...

Read More »
New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Printing & Duplicating Equipment

New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats

Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.

Read More »
New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Printing & Duplicating Equipment

New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats

Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.

Read More »
Company News

Rudolph Technologies Receives Orders for Over $15 Million from Major Memory Manufacturer

Process control systems used for advanced packaging of DRAM products in Korea and China facilities; additional orders expected to meet capacity ramp Wilmington, Mass. (January 15, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based in Asia. The systems will be...

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Company News

Rudolph Technologies Receives Orders for Over $15 Million from Major Memory Manufacturer

Process control systems used for advanced packaging of DRAM products in Korea and China facilities; additional orders expected to meet capacity ramp Wilmington, Mass. (January 15, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based in Asia. The systems will be...

Read More »
Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection
Test & Measurement

Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection

One quarter after release, the new Dragonfly platform achieves market recognition in advanced macro inspection with multiple deliveries to world’s largest OSAT Wilmington, Mass. (January 8, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the product. Several systems were delivered in...

Read More »
Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection
Test & Measurement

Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection

One quarter after release, the new Dragonfly platform achieves market recognition in advanced macro inspection with multiple deliveries to world’s largest OSAT Wilmington, Mass. (January 8, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the product. Several systems were delivered in...

Read More »
Company News

Rudolph's Novusedge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection

Backlog for recently released system increases to over $12M Wilmington, Mass. (12/11/2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the receipt of over $12M in new orders for its recently-released NovusEdge™ system for edge and backside inspection on bare silicon wafers. The new orders are for capacity expansions at our existing customers as well as orders from two additional...

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Company News

Rudolph’s Novusedge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection

Backlog for recently released system increases to over $12M Wilmington, Mass. (12/11/2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the receipt of over $12M in new orders for its recently-released NovusEdge™ system for edge and backside inspection on bare silicon wafers. The new orders are for capacity expansions at our existing customers as well as orders from two additional...

Read More »

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