Rudolph Technologies, Inc.

Software

Rudolph's Discover Yield Management Software Gains Traction in Advanced Packaging Applications

Back-end manufacturers adopt front-end strategies to maximize yields with analysis of inspection and metrology data Flanders, New Jersey - Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor, FPD, LED and solar industries, announced today the sale of its DiscoverÂ-® Yield Management Software to a major...

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Software

Rudolph's Discover Yield Management Software Gains Traction in Advanced Packaging Applications

Back-end manufacturers adopt front-end strategies to maximize yields with analysis of inspection and metrology data Flanders, New Jersey - Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor, FPD, LED and solar industries, announced today the sale of its Discover-® Yield Management Software to a major outsourced...

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Printing & Duplicating Equipment

Complete Lithography System meets advanced packaging needs.

Accommodating needs of semiconductor advanced packaging market, JetStep™ total lithography system- delivers full, closed-loop control. Components include JetStep 2X reduction stepper integrated with Rudolph equipment automation and fault detection software; NSX® inspection tool for CD overlay measurements; ProcessWORKS® APC run-to-run control system software; ARTIST® fault detection...

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Printing & Duplicating Equipment

Complete Lithography System meets advanced packaging needs.

Accommodating needs of semiconductor advanced packaging market, JetStep™ total lithography systemÂ- delivers full, closed-loop control. Components include JetStep 2X reduction stepper integrated with Rudolph equipment automation and fault detection software; NSX® inspection tool for CD overlay measurements; ProcessWORKS® APC run-to-run control system software; ARTIST®...

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Display & Presentation Equipment

Rudolph's Yield Management System Chosen for Manufacture of High Definition Displays in Mobile Devices

Genesis-® Enterprise offline yield analysis and data management will be used to maximize factory efficiency and identify causes of yield loss Flanders, New Jersey - Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor, FPD, LED and solar industries, announced today the sale of its Genesis Enterprise yield...

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Display & Presentation Equipment

Rudolph's Yield Management System Chosen for Manufacture of High Definition Displays in Mobile Devices

GenesisÂ-® Enterprise offline yield analysis and data management will be used to maximize factory efficiency and identify causes of yield loss Flanders, New Jersey - Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor, FPD, LED and solar industries, announced today the sale of its Genesis Enterprise yield...

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Machinery & Machining Tools

Rudolph's MetaPULSE System Selected for Advanced Packaging R&D

Dynamic growth in advanced packaging arena drives need for critical process characterization technologies Flanders, New Jersey - Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of inspection, metrology and process control software for semiconductor manufacturing, announced today that a premier global industry research center in Asia has purchased Rudolph's MetaPULSE-® G Metrology...

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Test & Measurement

Thin Film Metrology System meets needs of mobile display market.

Combining MetaPULSE measurement head with customized glass substrate handling, MetaPULSE-® FP uses Picosecond Ultrasonic Laser Sonar (PULSE(TM)) Technology to measure critical thickness of metal layers deposited during manufacturing process. This lends to precise process control while providing non-contact, non-destructive, on-product measurements of single- and multi-layered opaque thin films.

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Test & Measurement

Thin Film Metrology System meets needs of mobile display market.

Combining MetaPULSE measurement head with customized glass substrate handling, MetaPULSEÂ-® FP uses Picosecond Ultrasonic Laser Sonar (PULSE(TM)) Technology to measure critical thickness of metal layers deposited during manufacturing process. This lends to precise process control while providing non-contact, non-destructive, on-product measurements of single- and multi-layered opaque thin...

Read More »

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