Rudolph Technologies, Inc.

Machinery & Machining Tools

European Fab Installs Second Rudolph Inspection System to Meet 100-Percent Inspection Requirements of Automotive Industry

Fast, automated NSX tools become de facto standard FLANDERS, NJ (August 14, 2007)- Rudolph Technologies, Inc. (NASDAQ: RTEC), the leading provider of process control systems for the semiconductor manufacturing industry, today announced its NSX® 115 automated macro defect inspection tool has been selected by a major European fab for outgoing quality assurance of semiconductor devices...

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Test & Measurement

Thin Film Metrology Tool suits DRAM metrology applications.

MetaPULSE IIIa(TM) makes film thickness measurements in aluminum-based DRAM manufacturing processes using picosecond ultrasonic laser sonar (PULSE(TM)) technology, which provides on-product thickness and material characterization for opaque films over range of types, dimensions, and multilayered configurations. Suited for fab-worthy measurements in DRAM and flash memory manufacturing process...

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Software

Data Analysis Software provides yield management.

Offering comprehensive capture and analysis of process performance information, Discover(TM) Data Analysis System allows manufacturers to discover and act upon yield improvement opportunities. Defect classification and spatial pattern recognition minimize time spent reviewing known defects, while statistical process control with automated reporting and alerts gets critical information to correct...

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Test & Measurement

Multi-Surface Inspection System uses cluster architecture.

Offering full color, image-based inspection with real-time capture capability, Explorer(TM) Inspection Cluster uses adaptive wafer scheduling and offers flexible configurability. Individual systems can be configured with any combination of wafer backside and edge inspection capabilities to suit application. Designed for macro inspection, system is built on automated handling platform that...

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Test & Measurement

Wafer Inspection System suits price-sensitive applications.

Automated macro defect inspection solution, NSX® 100, is designed for back-end manufacturing environment as well as front-end quality assurance (QA) applications. Able to handle wafers up to 200 mm at throughputs to 88 wph, system detects macro defects (0.5 micron and larger) to provide QA and feedback on process performance. Balance of throughput and resolution is suited to processes such...

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Test & Measurement

Rudolph Continues Leadership in Automotive IC Inspection with Order from austriamicrosystems

FLANDERS, NJ (February 22, 2007)-Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in high-performance process control metrology, defect inspection and data analysis for the semiconductor manufacturing industry, today announced the sale of both front- and back-end inspection systems to austriamicrosystems (SWX: AMS), a leading global designer and manufacturer of high performance...

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Test & Measurement

Rudolph Reaches Milestone with 50th AXi System Installation at Korean Memory Manufacturer

FLANDERS, NJ (January 18, 2007)- Rudolph Technologies, Inc. (NASDAQ: RTEC), the leading provider of macro defect inspection systems for the semiconductor manufacturing industry, today announced a milestone 50th installation at a large Korean memory manufacturer for its AXi(TM) 930 Advanced Macro Defect Inspection System. AXi Systems are installed at the chip manufacturer's facilities in Korea as...

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Sensors, Monitors & Transducers

Systems detect defects and correlate them to frontside die.

Inspection tool-set, comprised of NSX(TM) and B20(TM) Systems, features backside color processing capability and auto-die classification. NSX Systems offer frontside inspection, B20 Systems offer backside inspection, and Harmony ASR(TM) (all-surface review) Software offers defect analysis and management. Combined with brightfield and darkfield capabilities, B20 Systems use color processing...

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Test & Measurement

Metrology System measures ultra thin films.

Combining PULSE Technology(TM) with MMXRF technology on single platform, Synergy MPX(TM) System measures ultra thin opaque films, such as ALD layers. PULSE Technology consists of picosecond ultrasonic laser sonar technique that provides non-contact, non-destructive opaque film measurements from 40 angstroms to 6 Â-µm. Monochromatic source eliminates virtually all background radiation, while...

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Test & Measurement

Inspection System offers all-surface macro defect detection.

Combining wafer frontside inspection capability of AXi(TM) 935 Macro Defect Inspection tool with edge inspection capability of E25(TM) Wafer Edge Inspection module, Wafer Inspection System accommodates automatic inspection of both front surface and edge of wafer without significantly impacting inspection throughput. Inspection data can be fed forward for automatic disposition of both wafers and...

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