Rudolph Technologies, Inc.

Macro Modules offer wafer edge and backside inspection.
Sensors, Monitors & Transducers

Macro Modules offer wafer edge and backside inspection.

Suitable for any production environment, E30(TM) and B30(TM) modules are suited for inspection and in-line monitoring of 32 nm manufacturing processes from front end of line (FEOL) through final manufacturing. Edge defects as small as 2 Â-µm on patterned, production wafers can be detected. Part of all-surface Explorer(TM) Inspection Cluster, modules can also be used with NSX(TM) Series...

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Inspection System handles 200 and 300 mm wafers.
Machinery & Machining Tools

Inspection System handles 200 and 300 mm wafers.

Model WS 3840(TM) combines laser triangulation technology that provides 3D measurements of bump height and coplanarity with TDI line scan camera that offers 2D image-based macro defect inspection for wafer surface and bump by measuring characteristics such as diameter, shape, and placement accuracy. Intelligent scheduling capabilities maximize handling throughput, and system imports and exports...

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Test & Measurement

Rudolph Technologies and Entrepix, Inc. Announce License Agreement

Entrepix to market Rudolph AutoEL Series Ellipsometer FLANDERS, NJ (November 27, 2007)-Rudolph Technologies, Flanders, New Jersey, and Entrepix, Inc., Tempe, Arizona, announced today that Rudolph has granted Entrepix an exclusive license to manufacture, sell, service and support the Rudolph AutoEL(TM)® series of thin-film ellipsometers. The AutoEL(TM)® was the first...

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Sensors, Monitors & Transducers

Rudolph Ships 100th Wafer Edge and Backside Inspection System

An increasing number of fabs recognize value of all-surface inspection FLANDERS, NJ (November 14, 2007) - Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in high-performance process characterization systems for the semiconductor manufacturing industry, today announced that it has shipped 100 of its edge and backside automated macro defect inspection tools to chipmakers around the...

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Metrology System offers tool for thin film wafer inspection.
Test & Measurement

Metrology System offers tool for thin film wafer inspection.

Utilizing multiwavelength focused beam ellipsometry (FBE), Model S3000A Transparent Thin Film Metrology System includes deep UV reflectometer that uses parallel data collection for throughput, precision, and spectral resolution. System features 633, 784, and 923 nm stabilized laser diodes and XPort platform for wafer handling with up to 4 TDK load ports, dual-arm robot, and built-in control of...

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Rudolph Technologies Announces Milestone Shipments of TrueADC Software for Automatic Defect Classification
Software

Rudolph Technologies Announces Milestone Shipments of TrueADC Software for Automatic Defect Classification

Installed base exceeds 30 systems; 18 shipped in most recent quarter Flanders, New Jersey (October 15, 2007)-Rudolph Technologies, Inc.(NASDAQ: RTEC), a leading provider of process characterization solutions for the semiconductor manufacturing industry, today announced that it has seen rapid acceptance of its TrueADC(TM) Software for automatic defect classification. First released in June 2006,...

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Sensors, Monitors & Transducers

Japan Fab Purchases Rudolph AXi System for Inspection of Automotive Devices

Macro inspection edges into space previously occupied by high-cost micro tools FLANDERS, NJ (October 1, 2007)- Rudolph Technologies, Inc.(NASDAQ: RTEC), a leading provider of process characterization solutions for the semiconductor manufacturing industry, today announced it has sold an AXi Automated Macro Defect Inspection System to a leading Japanese company in the automotive sector for...

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Software

Rudolph's DMSVision Software Improves Yield in Advanced 300 mm Memory Fabs

FLANDERS, NJ (September 17, 2007) - Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in high-performance process control metrology, defect inspection and data analysis for the semiconductor manufacturing industry, announced today that two 300 mm fabs have installed Rudolph's DMSVision(TM) fabwide software systems for yield management and control. The two major memory manufacturers...

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Rudolph Showcases AXi 935 Advanced Macro Defect Inspection System at SEMICON Taiwan 2007
Sensors, Monitors & Transducers

Rudolph Showcases AXi 935 Advanced Macro Defect Inspection System at SEMICON Taiwan 2007

Taiwan foundry selects Rudolph AXi for Copper CMP FLANDERS, NJ (September 10, 2007)- Rudolph Technologies, Inc. (NASDAQ: RTEC), the leading provider of process characterization systems for the semiconductor manufacturing industry, will showcase the AXi(TM) 935 Advanced Macro Defect Inspection System during SEMICON® Taiwan, taking place September 12-14, 2007 at the Taipei World Trade Center...

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Sensors, Monitors & Transducers

Rudolph Technologies Delivers Edge Inspection Tool to ASML Holding NV

Equipment will focus on the impact of wafer edge process control FLANDERS, NJ (September 4, 2007)-Rudolph Technologies (NASDAQ:RTEC) announced today it has provided an edge inspection tool to lithography system provider ASML Holding NV (ASML) (Euronext Amsterdam, NASDAQ: ASML) to help characterize wafer defects originating from process control issues at the wafer edge and accentuated by the...

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