Rudolph Technologies, Inc.
PO Box 860
Budd Lake, NJ 07828
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Inspection System offers application-specific configurations.
With Metrology suite, NSX-® 320 Automated Macro Defect Inspection System offers wafer level packaging configuration, which measures film thickness, thin remaining silicon thickness, surface topography, copper pillar height, and solder bump height. Advanced wafer level packaging configuration (2.5D) adds measurement of wafer profile, total stack thickness, and thick/thin RST, while 3DIC...
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Inspection System offers application-specific configurations.
With Metrology suite, NSXÃ-® 320 Automated Macro Defect Inspection System offers wafer level packaging configuration, whichÃÂ measures film thickness, thin remaining silicon thickness, surface topography, copper pillar height, and solder bump height. Advanced wafer level packaging configuration (2.5D) adds measurement of wafer profile, total stack thickness, and thick/thin RST, while...
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Panel Lithography System supports advanced packaging.
Capable of processing both glass and organic laminate panels in semiconductor advanced packaging market, JetStep™ features on-the-fly autofocus for thick photoresists, onboard reticle library,- and 6 second reticle change out wheel. System can utilize company's suite of software products, including ProcessWORKS® for run-to-run control, Discover® for yield management, and ARTIST® for...
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Panel Lithography System supports advanced packaging.
Capable of processing both glass and organic laminate panels in semiconductor advanced packaging market, JetStep™ features on-the-fly autofocus for thick photoresists, onboard reticle library,Ã- and 6 second reticle change out wheel. System can utilize company's suite of software products, including ProcessWORKSî for run-to-run control, Discoverî for yield management, and...
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Thin Film Metrology System targets 28 nm node and below.
Available for transparent films in advanced semiconductor fabrication applications, S3000SX™ System uses focused beam ellipsometry and small site measurement optics to measure thickness of single- and multi-layer films on product wafers, including device area at site sizes as small as 30 x 30 -µm. Available metrology options include deep UV (190 nm) reflectometry, wafer stress and bow...
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Thin Film Metrology System targets 28 nm node and below.
Available for transparent films in advanced semiconductor fabrication applications, S3000SX™ System uses focused beam ellipsometry and small site measurement optics to measure thickness of single- and multi-layer films on product wafers, including device area at site sizes as small as 30 x 30 Ã-µm. Available metrology options include deep UV (190 nm) reflectometry, wafer stress and bow...
Read More »Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications
• Validates commercialization of revolutionary 2X stepper total lithography solution • Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process Flanders, New Jersey- – Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and...
Read More »Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications
• Validates commercialization of revolutionary 2X stepper total lithography solution • Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process Flanders, New JerseyÃ- – Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED...
Read More »
Rudolph's NSX Macro Defect Inspection System Selected by Merit Sensor Systems
The automated inspection system will assure quality of pressure sensors used in critical applications. Flanders, New Jersey -- Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor and related industries,announced today that it has sold an NSX-®Series macro defect inspection system to Merit Sensor Systems, Inc., a...
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Rudolph's NSX Macro Defect Inspection System Selected by Merit Sensor Systems
The automated inspection system will assure quality of pressure sensors used in critical applications. Flanders, New Jersey -- Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor and related industries,announced today that it has sold an NSXÃ-®Series macro defect inspection system to Merit Sensor Systems, Inc.,...
Read More »