Rudolph Technologies, Inc.
PO Box 860
Budd Lake, NJ 07828
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Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for through Silicon Via Process Development
First NSX 320 Metrology system sold specifically for TSV application includes specialized sensors to measure critical parameters in 3D integration Flanders, New Jersey — Rudolph Technologies, Inc. (NYSE: RTEC) announced today the sale of its first NSX-® 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the Nanoelec Research...
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Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for through Silicon Via Process Development
First NSX 320 Metrology system sold specifically for TSV application includes specialized sensors to measure critical parameters in 3D integration Flanders, New Jersey — Rudolph Technologies, Inc. (NYSE: RTEC) announced today the sale of its first NSXÃ-® 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the Nanoelec...
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Rudolph Technologies Wins Multiple Lithography Orders
Systems sold into advanced packaging and flat panel display markets Flanders, New Jersey- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today it has received two orders for its lithography systems, totaling more than $11 million. Purchase orders include a repeat order for the JetStep™ Lithography System for advanced packaging (AP) applications and a repeat order for a PanelPrinter™...
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Rudolph Technologies Wins Multiple Lithography Orders
Systems sold into advanced packaging and flat panel display markets Flanders, New JerseyÃ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today it has received two orders for its lithography systems, totaling more than $11 million. Purchase orders include a repeat order for the JetStep™ Lithography System for advanced packaging (AP) applications and a repeat order for a...
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Rudolph Wins Multiple Orders for AWX Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications
AWX system combines the sensitivity, speed and data analysis needed to optimize back-end processes and minimize cost Flanders, New Jersey- — Rudolph Technologies, Inc. (NASDAQ: RTEC) announced today that it has won orders for its AWX™ FSI unpatterned wafer inspection system at both a major Southeast Asia-based outsourced assembly and test (OSAT) facility and a key Korean memory manufacturer....
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Rudolph Wins Multiple Orders for AWX Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications
AWX system combines the sensitivity, speed and data analysis needed to optimize back-end processes and minimize cost Flanders, New JerseyÃ- — Rudolph Technologies, Inc. (NASDAQ: RTEC) announced today that it has won orders for its AWX™ FSI unpatterned wafer inspection system at both a major Southeast Asia-based outsourced assembly and test (OSAT) facility and a key Korean memory...
Read More »Rudolph Technologies' Management System Earns ISO 9001:2008 Certification
Registration reflects commitment to continuous process improvement and pursuit of customer satisfaction Flanders, New Jersey — Rudolph Technologies, Inc. (NASDAQ: RTEC) announced today that it has earned certification to ISO 9001:2008 for its quality management system and shared services corporate departments at three of its major business unit locations. The rigorous certification process...
Read More »Rudolph Technologies' Management System Earns ISO 9001:2008 Certification
Registration reflects commitment to continuous process improvement and pursuit of customer satisfaction Flanders, New Jersey — Rudolph Technologies, Inc. (NASDAQ: RTEC) announced today that it has earned certification to ISO 9001:2008 for its quality management system and shared services corporate departments at three of its major business unit locations. The rigorous certification process...
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Defect Inspection System handles wafers up to 300 mm.
Designed for semiconductor, MEMS, and LED facilities, NSX-® 220 Automated Macro Defect Inspection System uses gray-scale image analysis with color image capture for inspection and metrology in final manufacturing applications. It can detect scratches, mechanical damage, foreign materials, voids, and probe damage, while also performing 2D measurements on bumps, probe marks, and edge trim...
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Defect Inspection System handles wafers up to 300 mm.
Designed for semiconductor, MEMS, and LED facilities, NSXÃ-® 220 Automated Macro Defect Inspection System uses gray-scale image analysis with color image capture for inspection and metrology in final manufacturing applications. It can detect scratches, mechanical damage, foreign materials, voids, and probe damage, while also performing 2D measurements on bumps, probe marks, and edge trim...
Read More »