Rudolph Technologies, Inc.

Sensors, Monitors & Transducers

Large Assembly and Test Facility Selects Rudolph NSX Series to Meet Advanced Packaging Demand

Wafer-level packaging drives inspection market growth - as demonstrated by this large order for 14 NSX Inspection Systems Flanders, New Jersey - Rudolph Technologies, Inc. (NASDAQ: RTEC), the leader in the high-growth market for back-end macro defect inspection, announced today that a large OSAT (outsourced semiconductor assembly and test) company has placed orders for 14 NSX® Series 320...

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Test & Measurement

Rudolph Enters New Market for Metrology in Back-End Packaging

MetaPULSE system measurements of UBM and RDL on product wafers displace monitor wafer methodology as pattern-dependent deposition effects become significant Flanders, New Jersey - Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor, LED and solar industries, announced today that it has delivered the first...

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Sensors, Monitors & Transducers

Rudolph Receives First Orders for 450 mm Defect Inspection and Thin Film Metrology Systems

Multiple systems will be used to provide performance feedback and qualification data for development of new processes Flanders, New Jersey - Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor, solar and LED industries, announced today it has received the first orders for its leading-edge defect inspection and...

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Software

Rudolph Fulfills Multiple System Orders for TSV Inspection and Metrology

Flexibility of Wafer Scanner and NSX Systems key in development of advanced 3D integration processes Flanders, New Jersey -Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor, solar and LED industries, announced today that it has shipped its Wafer Scanner(TM) 3880 3D Inspection System, multiple NSX® Macro...

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Software

Rudolph Delivers Run-to-Run Process Control to Bosch Automotive

Advanced process control yields immediate benefits including reduced variability and improved capability. Flanders, New Jersey -Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor, solar and LED industries, announced today that is has delivered and installed its ProcessWORKS® advanced process control (APC)...

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Software

Semiconductor Software provides yield analysis.

Offline yield analysis and data mining software, Genesis® Enterprise v7.0, helps maximize factory efficiency and identifies causes of yield loss. Along with parametric yield management tools, software delivers genealogy, charting and analysis, data management, wafer/sheet mapping, and bin map capabilities. Additional features include data acquisition and integration, automated decision...

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Automated Macro Defect Inspection System suits TSV processes.
Sensors, Monitors & Transducers

Automated Macro Defect Inspection System suits TSV processes.

Designed for packaging processes that use through silicon vias (TSV) to connect multiple die in one package, NSX® 320 provides inspection capabilities for edge trimming metrology, wafer alignment during bonding processes, sawn wafers on film frames, and other processes. Incorporated XSoft(TM) system software capabilities include high-speed staging and on-the-fly image capture as well as...

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Wafer Inspection System handles advanced packaging applications. .
Test & Measurement

Wafer Inspection System handles advanced packaging applications. .

Utilizing 3D laser triangulation technology, Wafer Scanner(TM) 3880 System provides 3D (height) and 2D measurement and inspection of micro and standard bumps, through silicon via post-via-fill copper protrusions, and re-distribution layers used in 3D IC packaging. High-resolution 3D sensor is designed specifically for micro bumps as small as few microns. Able to inspect flip chip and non-flip...

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Rudolph Launches F30 Advanced Macro Inspection Module
Controls & Controllers

Rudolph Launches F30 Advanced Macro Inspection Module

High throughput, robust capability among key features driving new orders Flanders, New Jersey -Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, today announced the global launch of the F30(TM) Advanced Macro Inspection Module, further extending the capabilities of the Explorer®...

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Sensors, Monitors & Transducers

Avago Technologies Selects Automated Inspection and Metrology Solution from Rudolph for Advanced Optoelectronic Devices

NSX inspection systems play key role in Avago's efforts to enhance process yields Flanders, New Jersey -Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announces orders for its NSX® Series from Avago Technologies Manufacturing (Singapore) Pte. Ltd. Avago will use the NSX System...

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