Rudolph Technologies, Inc.
550 Clark Drive
Budd Lake, NJ 07828
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Metrology Tools measure thin transparent films.
Utilizing FOCUS(TM) beam ellipsometry, S3000(TM) (300 mm) and S2000(TM) (200 mm) measure transparent films throughout device fabrication process. Laser light sources are used for optimal accuracy, stability, spot size, and tool-to-tool matching. Also provided, optional deep UV and visible reflectometry capabilities offer flexibility in addressing various applications throughout fabrication. Built...
Read More »Metrology Tools measure thin transparent films.
Utilizing FOCUS(TM) beam ellipsometry, S3000(TM) (300 mm) and S2000(TM) (200 mm) measure transparent films throughout device fabrication process. Laser light sources are used for optimal accuracy, stability, spot size, and tool-to-tool matching. Also provided, optional deep UV and visible reflectometry capabilities offer flexibility in addressing various applications throughout fabrication. Built...
Read More »Two U.S. Chipmakers Formally Recognize Rudolph All-Surface Macro Inspection System with Best of Breed Status
Flanders, New Jersey (May 17, 2006)-Rudolph Technologies, Inc. (NASDAQ:RTEC), the market leader in advanced macro defect inspection technologies, announced today that two major U.S. semiconductor manufacturers have designated Rudolph's all-surface, macro defect inspection system as best of breed. As automated inspection has brought frontside macro defects under greater control, chip manufacturers...
Read More »Two U.S. Chipmakers Formally Recognize Rudolph All-Surface Macro Inspection System with Best of Breed Status
Flanders, New Jersey (May 17, 2006)-Rudolph Technologies, Inc. (NASDAQ:RTEC), the market leader in advanced macro defect inspection technologies, announced today that two major U.S. semiconductor manufacturers have designated Rudolph's all-surface, macro defect inspection system as best of breed. As automated inspection has brought frontside macro defects under greater control, chip manufacturers...
Read More »Inspection System targets critical edge defects.
Using multiple color cameras, concurrent color image capture, and intrinsic ADC, E25(TM) System detects and classifies defects based on size, morphology, color, and location. Algorithm creates defect-free surface model of edge and uses model to detect defects. System provides edge inspection for CMP, etch, clean, deposition, pre-RTP, and final QA processes, and is designed to cope with curved...
Read More »Inspection System targets critical edge defects.
Using multiple color cameras, concurrent color image capture, and intrinsic ADC, E25(TM) System detects and classifies defects based on size, morphology, color, and location. Algorithm creates defect-free surface model of edge and uses model to detect defects. System provides edge inspection for CMP, etch, clean, deposition, pre-RTP, and final QA processes, and is designed to cope with curved...
Read More »Rudolph Technologies Announces Multiple-Tool Order from Premier Memory Solutions Provider in Taiwan
DRAM manufacturer intends to boost yield with automated macro defect inspection Flanders, New Jersey, March 13, 2006-¯Rudolph Technologies, Inc. (Nasdaq: RTEC), a leading provider of process control equipment for thin film measurement and macrodefect inspection during integrated circuit manufacturing, announced today the completion of a multiple system sale to a premier memory solutions provider...
Read More »Rudolph Technologies Announces Multiple-Tool Order from Premier Memory Solutions Provider in Taiwan
DRAM manufacturer intends to boost yield with automated macro defect inspection Flanders, New Jersey, March 13, 2006Ã-¯Rudolph Technologies, Inc. (Nasdaq: RTEC), a leading provider of process control equipment for thin film measurement and macrodefect inspection during integrated circuit manufacturing, announced today the completion of a multiple system sale to a premier memory solutions...
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