Rudolph Technologies, Inc.
PO Box 860
Budd Lake, NJ 07828
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Semiconductor Software provides yield analysis.
Offline yield analysis and data mining software, Genesis-® Enterprise v7.0, helps maximize factory efficiency and identifies causes of yield loss. Along with parametric yield management tools, software delivers genealogy, charting and analysis, data management, wafer/sheet mapping, and bin map capabilities. Additional features include data acquisition and integration, automated decision making...
Read More »Semiconductor Software provides yield analysis.
Offline yield analysis and data mining software, GenesisÃ-® Enterprise v7.0, helps maximize factory efficiency and identifies causes of yield loss. Along with parametric yield management tools, software delivers genealogy, charting and analysis, data management, wafer/sheet mapping, and bin map capabilities. Additional features include data acquisition and integration, automated decision...
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Automated Macro Defect Inspection System suits TSV processes.
Designed for packaging processes that use through silicon vias (TSV) to connect multiple die in one package, NSX-® 320 provides inspection capabilities for edge trimming metrology, wafer alignment during bonding processes, sawn wafers on film frames, and other processes. Incorporated XSoft(TM) system software capabilities include high-speed staging and on-the-fly image capture as well as range...
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Automated Macro Defect Inspection System suits TSV processes.
Designed for packaging processes that use through silicon vias (TSV) to connect multiple die in one package, NSXÃ-® 320 provides inspection capabilities for edge trimming metrology, wafer alignment during bonding processes, sawn wafers on film frames, and other processes. Incorporated XSoft(TM) system software capabilities include high-speed staging and on-the-fly image capture as well as...
Read More »
Wafer Inspection System handles advanced packaging applications. .
Utilizing 3D laser triangulation technology, Wafer Scanner(TM) 3880 System provides 3D (height) and 2D measurement and inspection of micro and standard bumps, through silicon via post-via-fill copper protrusions, and re-distribution layers used in 3D IC packaging. High-resolution 3D sensor is designed specifically for micro bumps as small as few microns. Able to inspect flip chip and non-flip...
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Wafer Inspection System handles advanced packaging applications. .
Utilizing 3D laser triangulation technology, Wafer Scanner(TM) 3880 System provides 3D (height) and 2D measurement and inspection of micro and standard bumps, through silicon via post-via-fill copper protrusions, and re-distribution layers used in 3D IC packaging. High-resolution 3D sensor is designed specifically for micro bumps as small as few microns. Able to inspect flip chip and non-flip...
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Rudolph Launches F30 Advanced Macro Inspection Module
High throughput, robust capability among key features driving new orders Flanders, New Jersey -Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, today announced the global launch of the F30(TM) Advanced Macro Inspection Module, further extending the capabilities of the Explorer-®...
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Rudolph Launches F30 Advanced Macro Inspection Module
High throughput, robust capability among key features driving new orders Flanders, New Jersey -Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, today announced the global launch of the F30(TM) Advanced Macro Inspection Module, further extending the capabilities of the ExplorerÃ-®...
Read More »Avago Technologies Selects Automated Inspection and Metrology Solution from Rudolph for Advanced Optoelectronic Devices
NSX inspection systems play key role in Avago's efforts to enhance process yields Flanders, New Jersey -Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announces orders for its NSX-® Series from Avago Technologies Manufacturing (Singapore) Pte. Ltd. Avago will use the NSX System for...
Read More »Avago Technologies Selects Automated Inspection and Metrology Solution from Rudolph for Advanced Optoelectronic Devices
NSX inspection systems play key role in Avago's efforts to enhance process yields Flanders, New Jersey -Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announces orders for its NSXÃ-® Series from Avago Technologies Manufacturing (Singapore) Pte. Ltd. Avago will use the NSX System...
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