Cadence Design Systems, Inc.
San Jose, CA 95134
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![New 3D Transient Solver Simulating Software Solves Electromagnetic Interference (EMI) System Design Issues](https://cfnewsads.thomasnet.com/images/medium/40039/40039925.jpg)
New 3D Transient Solver Simulating Software Solves Electromagnetic Interference (EMI) System Design Issues
Built on parallel matrix solver technology that handles workload levels to test prototypes for electromagnetic compatibility (EMC) compliance. Can quickly and accurately simulate large and complex hyperscale, automotive, mobile, and aerospace and defense systems. Capable of simulating large designs, reducing respins and accelerating time to market.
Read More »![New 3D Transient Solver Simulating Software Solves Electromagnetic Interference (EMI) System Design Issues](https://cfnewsads.thomasnet.com/images/medium/40039/40039925.jpg)
New 3D Transient Solver Simulating Software Solves Electromagnetic Interference (EMI) System Design Issues
Built on parallel matrix solver technology that handles workload levels to test prototypes for electromagnetic compatibility (EMC) compliance. Can quickly and accurately simulate large and complex hyperscale, automotive, mobile, and aerospace and defense systems. Capable of simulating large designs, reducing respins and accelerating time to market.
Read More »![New Celsius Thermal Solver Simulation Software Uses Matrix Solver Technology](https://cfnewsads.thomasnet.com/images/medium/40029/40029386.png)
New Celsius Thermal Solver Simulation Software Uses Matrix Solver Technology
Integrates with Cadence IC, package and PCB implementation platforms that accelerates and simplifies design iterations. Enables system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in design process. Performs both static and dynamic electrical-thermal co-simulations based on actual flow of electrical power in advanced 3D structures,...
Read More »![New Celsius Thermal Solver Simulation Software Uses Matrix Solver Technology](https://cfnewsads.thomasnet.com/images/medium/40029/40029386.png)
New Celsius Thermal Solver Simulation Software Uses Matrix Solver Technology
Integrates with Cadence IC, package and PCB implementation platforms that accelerates and simplifies design iterations. Enables system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in design process. Performs both static and dynamic electrical-thermal co-simulations based on actual flow of electrical power in advanced 3D structures,...
Read More »![Cadence Releases JasperGold Formal Verification Platform with Smart Proof Technology](https://cfnewsads.thomasnet.com/images/medium/40024/40024695.jpg)
Cadence Releases JasperGold Formal Verification Platform with Smart Proof Technology
Offered with machine learning technology and core formal technology enhancements. The machine learning helps in selecting and parameterizing solvers to enable first-time proofs. Features improved proof-core accuracy and new technology for deriving coverage from deep bug hunting an formal coverage analysis views.
Read More »![Cadence Releases JasperGold Formal Verification Platform with Smart Proof Technology](https://cfnewsads.thomasnet.com/images/medium/40024/40024695.jpg)
Cadence Releases JasperGold Formal Verification Platform with Smart Proof Technology
Offered with machine learning technology and core formal technology enhancements. The machine learning helps in selecting and parameterizing solvers to enable first-time proofs. Features improved proof-core accuracy and new technology for deriving coverage from deep bug hunting an formal coverage analysis views.
Read More »Cadence Tools and Flows Achieve Production-Ready Certification for TSMC's 12FFC Process
New technologies enable chip design for emerging mid-range mobility and high-end consumer applications SAN JOSE, Calif., Sept. 11, 2017 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Cadence® digital, signoff and custom/analog tools and flows have achieved v1.0 certification for TSMC's 12nm FinFET Compact (12FFC) process technology and are production ready for customers...
Read More »Cadence Tools and Flows Achieve Production-Ready Certification for TSMC's 12FFC Process
New technologies enable chip design for emerging mid-range mobility and high-end consumer applications SAN JOSE, Calif., Sept. 11, 2017 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Cadence® digital, signoff and custom/analog tools and flows have achieved v1.0 certification for TSMC's 12nm FinFET Compact (12FFC) process technology and are production ready for customers...
Read More »![Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node](https://cfnewsads.thomasnet.com/images/medium/40005/40005023.png)
Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node
Reference flow available for early customer engagement AUSTIN, Texas, June 20, 2017 - DESIGN AUTOMATION CONFERENCE - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its custom/analog and full-flow digital and signoff tools are now enabled for v0.5 of the GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET semiconductor technology. The 7LP process node is expected to deliver 40...
Read More »![Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node](https://cfnewsads.thomasnet.com/images/medium/40005/40005023.png)
Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node
Reference flow available for early customer engagement AUSTIN, Texas, June 20, 2017 - DESIGN AUTOMATION CONFERENCE - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its custom/analog and full-flow digital and signoff tools are now enabled for v0.5 of the GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET semiconductor technology. The 7LP process node is expected to deliver 40...
Read More »![New 3D Transient Solver Simulating Software Solves Electromagnetic Interference (EMI) System Design Issues](https://cfnewsads.thomasnet.com/images/medium/40039/40039925.jpg)
New 3D Transient Solver Simulating Software Solves Electromagnetic Interference (EMI) System Design Issues
Built on parallel matrix solver technology that handles workload levels to test prototypes for electromagnetic compatibility (EMC) compliance. Can quickly and accurately simulate large and complex hyperscale, automotive, mobile, and aerospace and defense systems. Capable of simulating large designs, reducing respins and accelerating time to market.
Read More »![New 3D Transient Solver Simulating Software Solves Electromagnetic Interference (EMI) System Design Issues](https://cfnewsads.thomasnet.com/images/medium/40039/40039925.jpg)
New 3D Transient Solver Simulating Software Solves Electromagnetic Interference (EMI) System Design Issues
Built on parallel matrix solver technology that handles workload levels to test prototypes for electromagnetic compatibility (EMC) compliance. Can quickly and accurately simulate large and complex hyperscale, automotive, mobile, and aerospace and defense systems. Capable of simulating large designs, reducing respins and accelerating time to market.
Read More »![New Celsius Thermal Solver Simulation Software Uses Matrix Solver Technology](https://cfnewsads.thomasnet.com/images/medium/40029/40029386.png)
New Celsius Thermal Solver Simulation Software Uses Matrix Solver Technology
Integrates with Cadence IC, package and PCB implementation platforms that accelerates and simplifies design iterations. Enables system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in design process. Performs both static and dynamic electrical-thermal co-simulations based on actual flow of electrical power in advanced 3D structures,...
Read More »![New Celsius Thermal Solver Simulation Software Uses Matrix Solver Technology](https://cfnewsads.thomasnet.com/images/medium/40029/40029386.png)
New Celsius Thermal Solver Simulation Software Uses Matrix Solver Technology
Integrates with Cadence IC, package and PCB implementation platforms that accelerates and simplifies design iterations. Enables system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in design process. Performs both static and dynamic electrical-thermal co-simulations based on actual flow of electrical power in advanced 3D structures,...
Read More »![Cadence Releases JasperGold Formal Verification Platform with Smart Proof Technology](https://cfnewsads.thomasnet.com/images/medium/40024/40024695.jpg)
Cadence Releases JasperGold Formal Verification Platform with Smart Proof Technology
Offered with machine learning technology and core formal technology enhancements. The machine learning helps in selecting and parameterizing solvers to enable first-time proofs. Features improved proof-core accuracy and new technology for deriving coverage from deep bug hunting an formal coverage analysis views.
Read More »![Cadence Releases JasperGold Formal Verification Platform with Smart Proof Technology](https://cfnewsads.thomasnet.com/images/medium/40024/40024695.jpg)
Cadence Releases JasperGold Formal Verification Platform with Smart Proof Technology
Offered with machine learning technology and core formal technology enhancements. The machine learning helps in selecting and parameterizing solvers to enable first-time proofs. Features improved proof-core accuracy and new technology for deriving coverage from deep bug hunting an formal coverage analysis views.
Read More »Cadence Tools and Flows Achieve Production-Ready Certification for TSMC's 12FFC Process
New technologies enable chip design for emerging mid-range mobility and high-end consumer applications SAN JOSE, Calif., Sept. 11, 2017 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Cadence® digital, signoff and custom/analog tools and flows have achieved v1.0 certification for TSMC's 12nm FinFET Compact (12FFC) process technology and are production ready for customers...
Read More »Cadence Tools and Flows Achieve Production-Ready Certification for TSMC's 12FFC Process
New technologies enable chip design for emerging mid-range mobility and high-end consumer applications SAN JOSE, Calif., Sept. 11, 2017 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Cadence® digital, signoff and custom/analog tools and flows have achieved v1.0 certification for TSMC's 12nm FinFET Compact (12FFC) process technology and are production ready for customers...
Read More »![Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node](https://cfnewsads.thomasnet.com/images/medium/40005/40005023.png)
Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node
Reference flow available for early customer engagement AUSTIN, Texas, June 20, 2017 - DESIGN AUTOMATION CONFERENCE - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its custom/analog and full-flow digital and signoff tools are now enabled for v0.5 of the GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET semiconductor technology. The 7LP process node is expected to deliver 40...
Read More »![Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node](https://cfnewsads.thomasnet.com/images/medium/40005/40005023.png)
Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node
Reference flow available for early customer engagement AUSTIN, Texas, June 20, 2017 - DESIGN AUTOMATION CONFERENCE - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its custom/analog and full-flow digital and signoff tools are now enabled for v0.5 of the GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET semiconductor technology. The 7LP process node is expected to deliver 40...
Read More »