Lam Research Corporation

New Striker FE Platform for Manufacturing High-aspect-ratio Chip Architectures
Machinery & Machining Tools

New Striker FE Platform for Manufacturing High-aspect-ratio Chip Architectures

Utilizes ICEFill™ technology for filling structures in 3D NAND, DRAM and logic devices at emerging nodes. Delivers the continued cost and technology scaling that is required to meet the semiconductor industry roadmap. CEFill technology removes the limitations for filling high-aspect-ratio features which are prevalent in 3D NAND devices as well as prevents collapse issues in DRAM and logic...

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Etching Machine delivers CD uniformity of 1 nm across wafer.
Labels Tags Signage & Equipment

Etching Machine delivers CD uniformity of 1 nm across wafer.

Addressing range of challenging etch applications, including high-k/metal gate, hardmask open, shallow trench isolation, and strained silicon, 2300® Versys® Kiyo3x Conductor Etch Series features wafer temperature control to enable radial tuning for edge control and profile shaping. It uses advanced pre-coat and post-etch chamber clean techniques. For complex film stacks such as...

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Bevel Cleaning System removes edge defects.

Bevel Cleaning System removes edge defects.

Available in both 200 mm and 300 mm configurations, plasma-based Coronus(TM) is built on 2300 platform with Dynamic Alignment, which provides repeatable target cleaning area, wafer-to-wafer and lot-to-lot. System is designed to minimize yield loss caused by defects that originate near wafer's edge. Target cleaning area can be defined precisely on top and bottom edges of wafer independently.

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Agricultural & Farming Products

Lam Research Corporation Ships First 300 mm 2300® Syndion(TM) System for 3-D IC Through-Silicon Via Etch

FREMONT, Calif., August 20, 2007-Lam Research Corporation (NASDAQ: LRCX) today announced it has shipped its first 300 mm 2300 Syndion etch system, designed for 3-D IC through-silicon via (TSV) etch applications. Additional 300 mm shipments are expected this quarter. Production release of the 2300 Syndion is planned during the first half of 2008. We believe we are the first supplier to ship a 300...

Read More »
New Striker FE Platform for Manufacturing High-aspect-ratio Chip Architectures
Machinery & Machining Tools

New Striker FE Platform for Manufacturing High-aspect-ratio Chip Architectures

Utilizes ICEFill™ technology for filling structures in 3D NAND, DRAM and logic devices at emerging nodes. Delivers the continued cost and technology scaling that is required to meet the semiconductor industry roadmap. CEFill technology removes the limitations for filling high-aspect-ratio features which are prevalent in 3D NAND devices as well as prevents collapse issues in DRAM and logic...

Read More »
Company News

Lam Research and VELO3D Strike Strategic Agreement to Use Metal Additive Manufacturing Applications for Production of Semiconductor Capital Equipment

Joint agreement includes proprietary process development and investment in VELO3D Campell, Calif., August 4, 2020 – Digital manufacturing innovator VELO3D and Lam Research Corporation (Nasdaq: LRCX) today announced a joint development agreement that includes collaboration on novel materials and designs in metal additive manufacturing (AM) or 3D printing applications for the semiconductor...

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Company News

Lam Research Breaks New Ground in Etch Technology and Productivity for Chipmaking Processes

Lam's new Sense.i platform delivers industry-leading output and innovative sensor technology Fremont, Calif., March 5, 2020 /PRNewswire/ - Lam Research Corp. (Nasdaq: LRCX) today announced the launch of a completely transformed plasma etch technology and system solution, designed to provide chipmakers with advanced functionality and extendibility required for future innovation. Lam's...

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Etching Machine delivers CD uniformity of 1 nm across wafer.
Labels Tags Signage & Equipment

Etching Machine delivers CD uniformity of 1 nm across wafer.

Addressing range of challenging etch applications, including high-k/metal gate, hardmask open, shallow trench isolation, and strained silicon, 2300® Versys® Kiyo3x Conductor Etch Series features wafer temperature control to enable radial tuning for edge control and profile shaping. It uses advanced pre-coat and post-etch chamber clean techniques. For complex film stacks such as...

Read More »
Bevel Cleaning System removes edge defects.

Bevel Cleaning System removes edge defects.

Available in both 200 mm and 300 mm configurations, plasma-based Coronus(TM) is built on 2300 platform with Dynamic Alignment, which provides repeatable target cleaning area, wafer-to-wafer and lot-to-lot. System is designed to minimize yield loss caused by defects that originate near wafer's edge. Target cleaning area can be defined precisely on top and bottom edges of wafer independently.

Read More »
Agricultural & Farming Products

Lam Research Corporation Ships First 300 mm 2300® Syndion(TM) System for 3-D IC Through-Silicon Via Etch

FREMONT, Calif., August 20, 2007-Lam Research Corporation (NASDAQ: LRCX) today announced it has shipped its first 300 mm 2300 Syndion etch system, designed for 3-D IC through-silicon via (TSV) etch applications. Additional 300 mm shipments are expected this quarter. Production release of the 2300 Syndion is planned during the first half of 2008. We believe we are the first supplier to ship a 300...

Read More »

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