Dymax Corp.
Torrington, CT 06790
New First-of-Kind Adhesives Formulated without IBOA and TPO
Features environmentally friendly, one-part formulations and solvent-free. Designed for bonding SS, PC, PI, PVC, TPU and low-surface-energy substrates. Applications include glucose monitors, large volume injectors, patient monitoring devices and pain management devices.
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New QX4 Version 2.0 LED Spot-Curing System Stores up to 20 Programs in Variable Mode
Features LED technology, compact size and curing versatility. Offers touch-screen interface, intensity up to 23 W/cm2 depending on the wavelength and PLC functionality. LED heads are available in 365, 385, or 405 nm wavelengths.
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New 1040-M Autoclave Resistant Adhesive Offers Low Water Absorption (0.5%)
Features broad-spectrum UV light and is optimized to be LED curable at 365 nm wavelength. Designed to be autoclave resistant for more than 100 cycles. Works as an encapsulant, protecting critical sensors and electronic components, where moisture ingression is an concern.
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New Dual-Cure 9771 Coating is Corrosion, Temperature and Humidity Resistance
Low ionic content and meets low outgassing ASTM E595 for cleaner PCBs. Features bright blue fluorescing tracer that is visible on boards before and after cure for high-speed, inline quality inspection. Developed for the use of printed circuit boards in missiles, satellites and spacecraft.
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New Low-Shrinkage Cationic Epoxy Features High Viscosity and Thixotropy
9803 has very low volumetric shrinkage, high Tg and low CTE. Improved 85°C/85% RH resistance and exhibits less movement through thermal excursions. Applications include bonding the lens barrel to the holder, lens bonding and bonding the holder to PCBs.
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New MechT E35A to Improve AM Material Performance
MechT E35A can be used in rigid, high tensile strength SLA, DLP or jettable 3D printing resins. Achieves up to 104-109 Ω/sq resistivity and provide carbon content with no carbon trails. Applications include low surface resistivity or conductive painting and high adhesion.
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New OP-81-LS Epoxy Offers Low Volumetric Shrinkage During Cure
Features low temperature (80-85°C) heat-curing function in applications where shadow areas exist. Cures in seconds upon exposure to broad-spectrum light for fast, precise optical assembly. Ideal for the positioning and bonding of lenses, prisms, fibers, or other optical components.
Read More »Conformal Coating Newly Certified to Military Specification MIL-I-46058
Added to the Defense Logistics Agency’s Qualified Products List (QPL) Torrington, Connecticut – October 15, 2020…Dymax 9483, a light-curable conformal coating with secondary ambient moisture-cure capability for shadow areas on PCBs, has successfully completed the rigorous qualification testing to Military Specification MIL-I-46058. This UL94 and UL746-E recognized dual-cure coating has also...
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New Cationic Epoxy Comes with Heat-Only Curing Functionality
Offers high bond strength to a variety of substrates including plastics, FR-4, and glass. Features lower water absorption in high-heat, humid environments. Curable with broad-spectrum UV/Visible light and/or with heat at 80-85°C in 20-35 minutes.
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New Encapsulant with Improved Moisture and Thermal Resistance
Multi-Cure® 9037-F cures in seconds upon exposure to UV/visible light and has secondary heat cure for shadow areas caused by high-profile components on printed circuit boards. Material features improved flexibility and resiliency for a variety of glob-top, chip-on-board, chip-on-flex, chip-on-glass and wire-tacking/bonding applications. Ideal for use as a corrosion guard for wire-bond...
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