Canon USA, Inc.

New i-line Stepper System for High-density Packaging

FPA-5520iV LF features 1.5 micrometer resolution and a wide exposure field of 52 mm x 68 mm. Offers wide exposure field of circuit patterns to meet packaging needs including heterogeneous integration. Redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.

New i-line Stepper System for High-density Packaging

FPA-5520iV LF features 1.5 micrometer resolution and a wide exposure field of 52 mm x 68 mm. Offers wide exposure field of circuit patterns to meet packaging needs including heterogeneous integration. Redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.

New Semiconductor Lithography System with Optional Through-Silicon Alignment System

FPA-3030i5a is designed to process small substrates between 50 and 200 mm in diameter. Features chamber temperature control system and employs a high-speed wafer feeding system. Supports silicon wafers as well as common compound semiconductor materials such as SiC and GaN.

New Semiconductor Lithography System with Optional Through-Silicon Alignment System

FPA-3030i5a is designed to process small substrates between 50 and 200 mm in diameter. Features chamber temperature control system and employs a high-speed wafer feeding system. Supports silicon wafers as well as common compound semiconductor materials such as SiC and GaN.

New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates

Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.

New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates

Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.

Recently expanded UVgel printer series offers increased flexibility to Canon Solutions America customers Melville, N.Y., Nov. 7, 2019 – Canon Solutions America, Inc., a wholly owned subsidiary of Canon U.S.A., Inc., joins its colleagues in Canon Europe in the announcement of the completion of more than 1,000 global installations of the Océ Colorado roll-to-roll wide format printer series,...

Customer Installations of The Océ Colorado Family of Printers Eclipses 1,000

Recently expanded UVgel printer series offers increased flexibility to Canon Solutions America customers Melville, N.Y., Nov. 7, 2019 – Canon Solutions America, Inc., a wholly owned subsidiary of Canon U.S.A., Inc., joins its colleagues in Canon Europe in the announcement of the completion of more than 1,000 global installations of the Océ Colorado roll-to-roll wide format printer series,...

MELVILLE, N.Y., Oct. 22, 2019 /PRNewswire/ -- Meeting the strictest chemical emission standards is crucial for printed products used indoors. Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its new UVgel ink has achieved the highest level of GREENGUARD Gold Certification by the UL Environment, a worldwide leading safety and certification company. UL Environment's...

Océ Colorado 1650 with UVgel 460 achieves GREENGUARD Gold Certification

MELVILLE, N.Y., Oct. 22, 2019 /PRNewswire/ -- Meeting the strictest chemical emission standards is crucial for printed products used indoors. Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its new UVgel ink has achieved the highest level of GREENGUARD Gold Certification by the UL Environment, a worldwide leading safety and certification company. UL Environment's...

Canon U.S.A. Receives ENERGY STAR® Partner of the Year - Sustained Excellence Award for 2021

This Prestigious Honor Signifies the Company's Ongoing Commitment to Environmental Sustainability through the use of Energy-Efficient Technologies in a Variety of Products Melville, N.Y., April 13, 2021 /PRNewswire/ -- Canon U.S.A., Inc., a leader in digital imaging solutions, announced today that it is the proud recipient of the 2021 ENERGY STAR® Partner of the Year Award for Sustained...

Canon U.S.A. Receives ENERGY STAR-® Partner of the Year - Sustained Excellence Award for 2021

This Prestigious Honor Signifies the Company's Ongoing Commitment to Environmental Sustainability through the use of Energy-Efficient Technologies in a Variety of Products Melville, N.Y., April 13, 2021 /PRNewswire/ -- Canon U.S.A., Inc., a leader in digital imaging solutions, announced today that it is the proud recipient of the 2021 ENERGY STAR® Partner of the Year Award for Sustained...

New i-line Stepper System for High-density Packaging

FPA-5520iV LF features 1.5 micrometer resolution and a wide exposure field of 52 mm x 68 mm. Offers wide exposure field of circuit patterns to meet packaging needs including heterogeneous integration. Redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.

New i-line Stepper System for High-density Packaging

FPA-5520iV LF features 1.5 micrometer resolution and a wide exposure field of 52 mm x 68 mm. Offers wide exposure field of circuit patterns to meet packaging needs including heterogeneous integration. Redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.

Canon Inc. Makes Carbon Disclosure Project's (CDP) 'A-List' in Two Categories

MELVILLE, N.Y., Dec. 17, 2020 /PRNewswire/ -- Canon U.S.A., Inc. today announced that its parent company, Canon Inc.,'s environmental initiatives have been recognized by the international environmental non-profit organization Carbon Disclosure Project (CDP)(1), based in the United Kingdom, in the fields of climate change and water security, and awarded a spot on the CDP's A-List in both...

Canon Inc. Makes Carbon Disclosure Project's (CDP) 'A-List' in Two Categories

MELVILLE, N.Y., Dec. 17, 2020 /PRNewswire/ -- Canon U.S.A., Inc. today announced that its parent company, Canon Inc.,'s environmental initiatives have been recognized by the international environmental non-profit organization Carbon Disclosure Project (CDP)(1), based in the United Kingdom, in the fields of climate change and water security, and awarded a spot on the CDP's A-List in both...

New Semiconductor Lithography System with Optional Through-Silicon Alignment System

FPA-3030i5a is designed to process small substrates between 50 and 200 mm in diameter. Features chamber temperature control system and employs a high-speed wafer feeding system. Supports silicon wafers as well as common compound semiconductor materials such as SiC and GaN.

New Semiconductor Lithography System with Optional Through-Silicon Alignment System

FPA-3030i5a is designed to process small substrates between 50 and 200 mm in diameter. Features chamber temperature control system and employs a high-speed wafer feeding system. Supports silicon wafers as well as common compound semiconductor materials such as SiC and GaN.

New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates

Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.

New FPA-8000iW Semiconductor Lithography System Can Handle 515 x 510 mm. Panel Substrates

Integrates projection optical system that offers wide exposure field and fine 1 μm pattern resolution. Designed for high-production efficiency by using 515 x 510 mm. organic panel substrates for Panel Level Packaging (PLP) applications. Supports PLP cost reduction and package scaling by providing high-productivity panel processing with large exposure field and high resolution.