Mitsubishi Heavy Industries America, Inc.

Automated Wafer Bonding Machine uses room temperature production.

Automated Wafer Bonding Machine uses room temperature production.

Eliminating heat stress and strain in bonding process, Bond Meister MWB-12-ST produces 3D integrated LSI (large-scale integration) circuits at room temperature. Fast atom beam (FAB) gun irradiates atoms for activating material surface to bond, and up to 20 ton weight loading is applicable for bonding. In addition to being able to perform wafer transfer and alignment, machine accommodates setting...

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Company News

New Combustor Center for Manufacturing Aero Engine Parts to be Established within MHI's Nagasaki Shipyard & Machinery Works

- Targets Set on World-class Efficiency: Response to Expanding Aircraft Engine Production - - Plant will serve as Mitsubishi Heavy Industries Aero Engines' Nagasaki Works; construction to be completed in July 2020 - Fully integrated production of combustor parts for PW1100G-JM engines TOKYO, Aug 19, 2019 - (JCN Newswire) - Mitsubishi Heavy Industries, Ltd. (MHI) has taken the decision to...

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People in the News

Mitsubishi Heavy Industries America Corrugating Machinery Division Hires Industry Veteran as New Senior Sales Manager for North America

Hunt Valley, MD (August 9, 2019) -- The Corrugating Machinery Division of Mitsubishi Heavy Industries America is pleased to announce the hiring of a new Senior Sales Manager for North America. Mitsubishi Heavy Industries America (MHIA) is a leading supplier of Corrugating and Box Making machinery. Patrick Ranson is heading up sales efforts for the North American market, comprising the United...

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Automated Wafer Bonding Machine uses room temperature production.

Automated Wafer Bonding Machine uses room temperature production.

Eliminating heat stress and strain in bonding process, Bond Meister MWB-12-ST produces 3D integrated LSI (large-scale integration) circuits at room temperature. Fast atom beam (FAB) gun irradiates atoms for activating material surface to bond, and up to 20 ton weight loading is applicable for bonding. In addition to being able to perform wafer transfer and alignment, machine accommodates setting...

Read More »

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