Creative Materials, Inc.

Packaging Products & Equipment

Translucent Conductive Ink offers 75-90% opacity.

Providing conductivities as low as 4 W-cm, screen-printable 124-31 Ink and Coating adheres to variety of substrates without prior surface treatments. Optical properties allow end user to print conductive traces with limited opacity at thicknesses up to and over 1 mil. Offering resistance to creasing and scratching, as well as solvents, ink is suited for high-resolution touch screen displays,...

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Adhesives & Sealants

Conductive Inks/Adhesives suit thin film photovoltaic cells.

Adhering to variety of transparent conductive oxides, Silver Conductive Inks and Adhesives operate in high humidity environments and provide optimal environmental aging. Inks are used in grid lines and buss bars printed onto TCO's in thin film solar cells, while adhesives connect multiple solar cells to build arrays. Two-component 118-09A/B187 ink offers 0.0005 W-cm volume resistivity, while...

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Adhesives & Sealants

Adhesives have operating temperature range of -55 to 230°C.

Offered for variety of application techniques such as screen-printing, pad-printing, stencil application, and B-staged films, 118-06 series of single-component, electrically conductive, epoxy adhesives are also available as adhesive films, pre-cast on release liner at dry thicknesses ranging from 10-125 microns. B-staged adhesive films are already partially cured and can complete cure with exact...

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Adhesives & Sealants

Adhesive is formulated for silicone and flourinated surfaces.

Suited for range of fastening and bonding applications, Type 102-32 offers adhesion to metals, plastics, and glass, and is resistant to flexing and creasing, due to low temperature flexibility. Low stress nature allows for electrical attachment of stress sensitive devices. Electrically conductive adhesive can be spray applied onto hard to stick surfaces by thinning with fast evaporating solvent,...

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Packaging Products & Equipment

Conductive Ink adheres to Kapton, Mylar, and glass.

Resistant to flexing and creasing, Type 125-04 contains silver/copper alloy with sheet resistivity of 25 mW/sq/mil. Applied by screen printing, dipping, and syringe dispensing, it exhibits best properties when cured for several minutes at 150°C. With thermal stability good to 325°C, product has viscosity of 30,000 cps and volume resistivity of 0.000063 W/cm when cured. Applications...

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Adhesives & Sealants

Conductive Epoxy Adhesives offer cure times from 7-10 sec.

Featuring thermal stability and chemical resistance, 124-34A/B-187 consists of 2-component syringe dispensable, isotropically electrically conductive, epoxy adhesive, while 125-01A/B-187 offers 2-component syringe dispensable, anisotropically conductive version of product. Cure times as fast as 7-10 seconds can be achieved at elevated temperatures. Applications include assembly of electrical and...

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Adhesives & Sealants

Adhesive and Epoxy are designed for flip chip assembly.

Material GPC-251A/B is silver-filled, electrically conductive, 2-part, room-temperature curing adhesive used to connect bumps on underside of circuit boards. Product cures in 24 hr @ 25°C, 60 min @ 65°C, and 5 min @ 120°C. Material 123-38A/B-187 is thermally conductive underfill epoxy that strengthens chip package, protecting it from moisture and adding mechanical strength....

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Adhesives & Sealants

Adhesive is electrically and thermally conductive.

Single-component, silver-filled, polyimide No. 122-47 adhesive is suitable for application by stamping, screen printing, dipping, and syringe dispensing. Cure schedule allows for rapid processing and resulting bond exhibits thermal stability and chemical resistance at greater than 250°C. Adhesive also provides low coefficient of expansion. Applications include die attachment, surface...

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Packaging Products & Equipment

Conductive Ink suits plated through hole applications.

Type 122-22 screen printable, electrically conductive ink and coating maintains stable viscosity during all application methods and has low odor. It adheres to FR2, FR3, and FR4, printed circuit board substrates, as well as Kapton, Mylar, and glass. Product is resistant to abrasion, scratching, and thermal aging. It can be cured for 30 min at 70°C followed by post cure of 30 min at...

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Adhesives & Sealants

Epoxy Adhesive provides die attachment.

No. 122-38(SD) single-component, silver-filled, electrically conductive adhesive is 100% solids and syringe dispensable. It offers fine pitch resolution when syringed dispensed, stencil printed, or screen-printed. Epoxy provides adhesion to gold-plated substrates, as well as tin/lead solder-terminated components. It features chemical resistance, thermal stability to 325°C, and useful...

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