Indium Corporation
Suite 301
Clinton, NY 13323
Interconnect Flux is water-soluble.
Designed for use in BGA bumping and board level attachment, WS-364 water-soluble paste-flux can be applied by pin-transfer or stencil printing. It can be cleaned using room-temperature water and offers high yield in BGA bumping process. Available in syringes or cartridges, halide-free product is suitable for Sn/Pb and Pb-free applications.
Read More »
Solder Wire is comprised of high-purity materials.
Die Attach Solder Wire is manufactured from minimum of 99.9% pure materials with controlled oxide levels to facilitate wetting. It can be made to specific process or piece of equipment using advanced processes to hold to crucial diameters and tolerances for proper volume deposits. Standard packaging is available in 30-40 m spools; however custom spooling is available.
Read More »