Indium Corporation
Suite 301
Clinton, NY 13323
Indium Corporation Wins Vision Awards on Two Continents
Date: May 15, 2008 Indium Corporation's Indium8.9 Pb-Free No-Clean Solder Paste was honored twice in two weeks with leading electronics assembly awards. Indium8.9 earned the VISION Award at the APEX convention in Las Vegas, NV, and just one week later, garnered the China VISION award at NEPCON China in Shanghai, China. Sponsored by SMT Magazine, and SMT China Magazine, the VISION Awards honor the...
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Indium Corporation Exhibits at European Photovoltaic Solar Energy Conference
Date: August 9, 2007 Indium Corporation will be exhibiting at the 22nd European Photovoltaic Solar Energy Conference and Exhibition in Milano, Italy, September 3-7, 2007. At the show, Indium Corporation will launch several new products including, OnSpec® CIG Sputtering Targets, Metallization Paste for thin film solar cells (CIGS, CdTe, and a-Si), and Metallization Pastes for crystalline silicon...
Read More »Indium Corporation Wins 2007 Innovation Award
May 2, 2007 - Indium Corporation's Indium5.1AT Pb-Free Solder Paste was awarded the Innovation Award at Nepcon China in Shanghai, China. Sponsored by EM Asia Magazine, the Innovation Award recognizes excellence in the Asian electronics industry. This is the third award for Indium Corporation's Indium5.1AT Solder Paste. It was awarded the Global Technology Award in 2006 and the 2007 SMT China...
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Indium Corporation to Emphasize Reliability at Mexitrónica
Indium Corporation will feature their RELIABILITY program at Mexitrónica, October 10-12, 2006 in Guadalajara, Mexico. A key element of this program is the company's Indium5.1 Series of Pb-Free No-Clean Solder Pastes. According to Ray Altieri, Indium Corporation Market Manager, this series features unsurpassed print transfer efficiency through small apertures, low BGA/CSP voiding across a wide...
Read More »Indium Corporation Features Reliability Program at Semicon West
Indium Corporation will highlight its Reliability Program at its exhibit at Semicon West on July 10-14 at the Moscone Center in San Francisco, CA. Indium's team of experts will be available at booth #8423 to answer questions and provide information. With the increasing demands for power and miniaturization driving thermal management issues as well as CSP Reliability, Indium Corporation is...
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Indium Corporation's NF260 Wins Third Prestigious Award
Indium Corporation's NF260 No-Flow Underfill was awarded the 2006 EM Asia Innovation Award at Nepcon Shanghai, China. Sponsored by EM Asia Magazine, the Innovation Award recognizes, rewards, and celebrates excellence in the Asian electronics industry. Indium's NF260 No-Flow Underfill has also earned the Global Technology Award at Productronica in November 2005 and the Vision Award at APEX in...
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Indium Corporation Wins 2006 Vision Award
Indium Corporation's NF260 No-Flow Underfill earned the 2006 Vision Award at the APEX show in Anaheim, CA. Sponsored by SMT Magazine, the Vision Award recognizes innovativeness, cost effectiveness, speed/throughput improvements, quality contributions, ease of use, maintainability/repairability, and environmental responsibility. This is the second award for Indium's NF260 No-Flow Underfill, having...
Read More »Solder Flux targets Pb-free wave soldering.
Suited for soldering surface-mount, mixed-technology, and through-hole electronics assemblies, 1075-EXR is water-based and non-flammable, eliminating special storage requirements and minimizing VOC emissions. Product provides surface wetting, eliminates cleaning, and minimizes solder balling. It can also be used for Sn/Pb assemblies.
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Water-Soluble Solder Paste is lead-free.
Suited for fine-pitch applications, Indium3.1 exhibits beneficial wetting under air and nitrogen reflow atmosphere. Low-voiding, low-foaming product exhibits slump resistance and results in shiny and smooth solder joints. Stencil life virtually eliminates solder paste waste, and any residue is cleaned with water. Product comes in 500 g jars and 700 g cartridges.
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Wave Solder Flux suits Pb-free applications.
No-clean, halide-free 3592-35 provides heat stability for high temperatures required in Pb-free wave soldering of mixed-technology and through-hole electronic assemblies. Solvent-based formulation offers wide process window and minimizes solder balling. It can be used with tin/copper, tin/silver/copper, and tin/lead alloys.
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