Indium Corporation
Suite 301
Clinton, NY 13323
Indium Corporation Features Heat-Spring® for LED Manufacturing at Strategies in Light
Indium Corporation will feature Heat-Spring-®, a compressible, recyclable, metal thermal interface material, at Strategies in Light, Feb. 24-26 in Las Vegas, Nev. The use of high-power LEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials. Indium Corporation’s Heat-Spring is a...
Read More »Indium Corporation Wins Global Technology Award
Indium Corporation was presented with the Global Technology Award for its BiAgX-® solder paste at SMTA International in Rosemont, Ill. on Tuesday, September 30. Sponsored by Global SMT Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years. BiAgX-® was created specifically for...
Read More »Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at IMAPS
Indium Corporation will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), Oct. 14-16 in San Diego, Calif. NC-26-A is a halogen-free, no-clean flip-chip dipping flux designed to leave a clear, undetectable residue that allows the manufacturer to...
Read More »Free-Flowing Gallium Trichloride comes in granulated form.
Via its granulated form, EZ-Pour™ Gallium Trichloride (GaCl3) enables efficient and consistent transfer between vessels and processing equipment. Clumping is eliminated while fostering accelerated, safe, and accurate transfer. Physical properties negate need for mallable container, and product can be shipped in boroslicate glass without losing its free-flowing nature. Also, transparency of...
Read More »Indium Corporation Features RMA-155 Pb-Free Solder Paste at SMTAi
Indium Corporation will feature its new Pb-free solder paste, RMA-155, at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill. RMA-155 was designed for balanced performance, making it ideal for high-complexity boards with a variety of component sizes. Compatible with both SnPb and SAC alloys, RMA-155 delivers...
Read More »Indium Corporation Features High-Reliability, Low-Voiding Flux Coating for Solder Preforms at IMAPS
Indium Corporation will feature LV1000 solder preform flux coating at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif. LV1000 is a high-reliability, low-voiding flux coating for solder preforms. It reduces ICT false failures while increasing productivity, throughput yields,...
Read More »Indium Corporation Features Indium10.1 Pb-Free Solder Paste at SMTAi
Indium Corporation will feature its new solder paste, Indium10.1, at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of Indium10.1 provide...
Read More »Pb-Free Solder Paste suits high complexity PCBs.
Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, optimal response-to-pause, and strong oxidation barrier, even for long and hot profiles. Halogen-free product resists graping on small components and tiny deposits, prevents head-in-pillow defects, and minimizes voiding for BGAs and large thermal planes. Conforming to RMA classification for QQ-S-571F,...
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Indium Corporation Features SACm(TM) High-Reliability Solder Paste at SMT Hybrid Packaging
Indium Corporation will feature SACm™ solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany. SACm™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACm™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength...
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Indium Corporation Features Heat-Spring® Thermal Interface Material at PCIM
Indium Corporation will feature its Heat-Spring-® Thermal Interface Material at PCIM May 20-22 in Nuremberg, Germany. Heat-Spring-® is a patented technology designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs-® offer uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of the Heat-Spring minimizes...
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