Indium Corporation
Suite 301
Clinton, NY 13323
Indium Corporation Features Heat-Spring® for IGBT Assembly at PCIM
Indium Corporation will feature Heat-Spring-®, a compressible, recyclable, metal thermal interface material, at PCIM Europe, May 19-21 in Nuremberg, Germany. Indium Corporation's Heat-Spring is a compressible soft metal shim that serves as a thermal interface between the baseplate and heat-sink to ensure maximum heat transfer in IGBT and high power module mounting applications. Heat-Spring is...
Read More »Flux Coating helps meet flatness, tight tolerance needs.
Available for solder preforms,- LV1000- is halide-free, meets ROL0 requirements, and- passes Telcordia GR-78 testing in unactivated state. Durability of glossy, uniform coating facilitates integration of this material into automated assembly processes, while minimal voiding accommodates bottom termination components that do not allow for proper outgassing of volatized flux. With tolerances...
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Indium Corporation Features InFORMS® at PCIM
Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS-®, at PCIM Europe, May 19-21 in Nuremberg, Germany. InFORMS are patented fabrications in which braided, woven, or random-fiber metal substrate materials are embedded into a solder preform. This technology is ideally suited for IGBT assembly of the DBC to the baseplate. InFORMS create solder joints with a...
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Indium Corporation Releases BiAgX® Solder Paste Technology as Drop-In Replacement for High-Pb Solders
Environmental and legislative concerns are driving consumers away from products using solders that contain lead (Pb), including solders used in die-attach applications for analog semiconductor assembly. Indium Corporation's BiAgX-® solder paste technology is a high-melting, lead-free (Pb-free) solder paste technology that serves as a drop-in replacement for the high-Pb solders used in many...
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Indium Corporation Features High-Purity Indium at SVC
Indium Corporation will feature its high-purity indium at the Society of Vacuum Coaters 58th Annual Technical Conference (SVC TechCon) April 25-30 in Santa Clara, Calif. High-purity indium is refined using advanced processes that are controlled with rigorous quality standards. Purity is verified using advanced analytical instrumentation such as inductively coupled plasma (ICP) and glow discharge...
Read More »Indium Corporation Receives NPI Award
Indium Corporation was presented with CIRCUITS ASSEMBLY’s NPI Award for its LV1000 flux coating for solder preforms at the IPC APEX Expo on Feb. 24 in San Diego, Calif. Sponsored by CIRCUITS ASSEMBLY, the NPI Awards program recognizes the electronics assembly industry’s leading new products. Awards are selected by an independent panel of practicing industry engineers. LV1000is a series of...
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Halogen- and Pb-Free Solder Paste improves ICT first-pass yields.
Formulated to accommodate processing temperatures required by SnAgCu, SnAg, and other alloy systems used by electronics industry, Indium10.5HF no-clean- solder paste conserves time and increases output for companies that require ICT as part of their normal production. Soft, pliable, non-tacky residue minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields,...
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Indium Corporation Features Heat-Spring® for LED Manufacturing at Strategies in Light
Indium Corporation will feature Heat-Spring-®, a compressible, recyclable, metal thermal interface material, at Strategies in Light, Feb. 24-26 in Las Vegas, Nev. The use of high-power LEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials. Indium Corporation’s Heat-Spring is a...
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Indium Corporation Features NC-SMQ®75 Die-attach Solder Paste at Productronica China
Indium Corporation will feature NC-SMQ-®75 die-attach solder paste at Productronica China March 17-19, 2015, at the Shanghai New International Expo Centre in Shanghai, China. NC-SMQ75 is an ultralow residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable, residue of approximately 0.4 weight percent of paste. It is designed for reflow in a nitrogen or...
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Indium Corporation Features Indium10.1 Pb-Free Solder Paste at APEX
Indium Corporation will feature its new solder paste, Indium10.1, at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance, with complete...
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