Indium Corporation

Avoid the Void(TM): Indium Corporation's Indium8.9HF Solder Paste to be Featured at SMTAI
Materials

Avoid the Void(TM): Indium Corporation's Indium8.9HF Solder Paste to be Featured at SMTAI

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste at SMTA International (SMTAI) 2016 on Sept. 27 and 28, in Rosemont, Ill. Indium8.9HF is specifically formulated to Avoid the Void™ while delivering high transfer efficiency with low variability. This no-clean solder paste is perfectly suited for a variety of applications, especially automotive, due to its unique...

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Water-Soluble Solder Paste is suited for PCB assembly.
Materials

Water-Soluble Solder Paste is suited for PCB assembly.

Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes.Â- In addition to minimizing voiding on QFNs, BGAs, and CSPs, product also maintains...

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Inorganic Indium Compounds offer diverse product solutions.

Inorganic Indium Compounds offer diverse product solutions.

Among others, inorganic compound offeringsÂ- – indium oxide, indium-tin oxide (ITO), indium trichloride, indium hydroxide, indium sulfide, and indium sulfate – can be provided in various crystal forms to address diverse applications. ITO, as transparent conductor, is used for manufacturing flat panel displays, LCDs, and touch sensors, while indium trichloride is...

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Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016
Materials

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which will be held on March 15-17 in Las Vegas, Nev. Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved...

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Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016
Materials

Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical. Gold-based solder has a high melting point, ranging from 280°C to 1064°C (depending on the alloy), making it compatible with subsequent reflow...

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Indium Corporation Features Indium8.9HF, Indium10.1 Solder Pastes at NEPCON South China
Materials

Indium Corporation Features Indium8.9HF, Indium10.1 Solder Pastes at NEPCON South China

Indium Corporation will feature its Indium8.9HF and Indium10.1 solder pastes at NEPCON South China 2015, on Aug. 25-27, in Shenzhen, China. Pb-free, halogen-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer, and communications. This is due to its high print transfer efficiency and robust reflow process window capability. With reliable...

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Indium Corporation Features Indium8.9HF Solder Paste at SMTAI
Machinery & Machining Tools

Indium Corporation Features Indium8.9HF Solder Paste at SMTAI

Indium Corporation will feature Indium8.9HF, a halogen-free, no-clean solder paste with excellent performance stability during printing, at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill. Pb-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer and communications. This is due to its high print transfer efficiency and robust...

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Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at SEMICON Taiwan
Materials

Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at SEMICON Taiwan

Indium Corporation will feature the newest in flux technology with its ultra-low and near-zero residue (ULR/NZR) no-clean Flip-Chip Flux product line at SEMICON Taiwan 2015 in Taipei, Taiwan. Indium Corporation’s ultra-low and near-zero residue no-clean Flip-Chip Fluxes eliminate the cost of cleaning flux residues and prevent damage to the die from stresses during cleanings. Flip-Chip Flux...

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Materials

Indium Corporation Receives SMT China Vision Award

Indium Corporation was presented with the SMT China Vision Award for its Indium10.1 solder paste at NEPCON China on April 21 in Shanghai, China. The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. Each product entry was evaluated based on its...

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