Dexter Corp., The
15051 E. Don Julian Rd.
City of Industry, CA 91746
City of Industry, CA 91746
Share:
Liquid Epoxy Encapsulant provides fast capillary flow.
HysolÃ-® FP4549FC package level underfill is designed to offer excellent adhesion to flip-chip assemblies containing no-clean flux residues. Qualified to perform in 260Ã-
Read More »
Conductive Adhesive is silver-filled.
QMI 526 silver-filled, thermally conductive adhesive can be cured inline using Skip-Cure(TM) processing in 8 sec at 150Ã-
Read More »
Liquid Epoxy Encapsulant provides fast capillary flow.
HysolÃ-® FP4549FC package level underfill is designed to offer excellent adhesion to flip-chip assemblies containing no-clean flux residues. Qualified to perform in 260Ã-
Read More »
Conductive Adhesive is silver-filled.
QMI 526 silver-filled, thermally conductive adhesive can be cured inline using Skip-Cure(TM) processing in 8 sec at 150Ã-
Read More »