Henkel Corporation
Irvine, CA 92606
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New xPRO410 Photopolymer is Ideal for General Purpose Prototyping
Formulated based on Loctite PRO410 polymer and optimized for the Nexa3D’s NXE400 3D printer. Offers extremely high accuracy and exceptional surface finish. Enables fast and accurate printing of parts for a wide range of form, fit and function designs and beautiful appearance prototypes.
Read More »
New Thermal Gel from Henkel Offers Stable Viscosity in Storage and in Use
Accommodates gaps up to 3.0 mm. and provides production simplicity as pre-cured formulation requires no mixing or refrigeration. Features vertical gap stability with no slipping during more than 1,000 hours of gap stability testing. Can withstand environmental and positioning demands of infrastructure components.
Read More »
New microTIM Micro-Thermal Interface Coatings Reduce Heat Per Pluggable Optical Module (POM)
Facilitate greater heat dissipation from the module, reducing operational temperature at a rate of 0.33° C per watt. Resistant to salt corrosion, abrasion and vibration, and are compatible with service temperatures from -40° C to +200° C. Offers transition to 400 Gb modules, the power level per POM can reach as high as 15 watts.
Read More »
Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...
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New Henkel Underfill Operates at High Temperatures For use in Aero and Auto Electronics
Henkel's new under-fill Loctite Eccobond UF 1173 operates at high temperatures of 155 degrees C. Applications include use in driver assistance systems with products such as cameras, and radars in both the automotive and aerospace industries.
Read More »
Peelable Thermal Interface Material (TIM) from Henkel Recognized with Industry Accolade
Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material Irvine, CA – Notching its second notable industry prize, Henkel’s BERGQUIST® Gap Filler TGF 1500RW liquid thermal interface material recently took top honors in the Global Technology Awards’ adhesives/coatings/encapsulants/TIMs category. The award contest, which is sponsored by Global SMT and Packaging...
Read More »
New Thermally Conductive Laminate from Henkel Provides a Higher Standoff
Henkel has released a new version of their BERGQUIST® BONDPLY® LMS-HD thermally conductive laminate material. The material has an increased thickness and is capable of providing a higher standoff between the device and heat sink for reinforced insulation. The material is a heat-curable formulation which offers a thermal performance of 1.4 W/m-K and strong adhesion. It complies with the...
Read More »
New LOCTITE ABLESTIK CF 3366 Assembly Film Offers Void-Free Bondline with Controlled Thickness
The LOCTITE® ABLESTIK® CF 3366 Assembly Film maintains adhesion strength up to temperatures as high as 175°C and has a curing capability at temperatures as low as 125°C. The product is suitable for aircraft, unmanned aerial vehicles (UAVs), communications and cybersecurity infrastructure applications. The film can be cut into complex shapes and patterns to accommodate any assembly dimensions....
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Henkel Highlights Thermal Management Solutions at the Battery Show North America 2018
BERGQUIST® Brand Liquid and Pad Thermal Interface Materials Improve Performance, Lifetime and Reliability of Li-Ion Automotive Battery Systems Irvine, CA – Henkel’s BERGQUIST® brand of thermal management materials is the market leader in versatile, reliable and cost-effective heat dissipation solutions across nearly all electronic market segments. In the automotive space, specifically...
Read More »
New Electrically Conductive Adhesives Increase Module Performance
Henkel’s LOCTITE® ABLESTIK® ICP 8000 series Electrically Conductive Adhesives are designed for accommodating assembly processes such as shingled solar modules and cell interconnect ribbon bonding. The products offer compatibility with wafer thickness of less than 160 µm and printing and dispensing speeds of more than 200 mm per second. The adhesives increase in-line inspection and can cures...
Read More »EnvisionTEC and Henkel to Combine 3D Printing and Photopolymer Material Chemistry Expertise for End-Use Parts
Combination of EnvisionTEC 3D printers and Henkel photopolymers drives next level of additive manufacturing in industrial production EnvisionTEC and Henkel today have announced an expansion of their partnership agreement to further drive the adoption of production level 3D Printing. Over the past two years the companies already have collaborated on a variety of unique applications. With the...
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New xPRO410 Photopolymer is Ideal for General Purpose Prototyping
Formulated based on Loctite PRO410 polymer and optimized for the Nexa3D’s NXE400 3D printer. Offers extremely high accuracy and exceptional surface finish. Enables fast and accurate printing of parts for a wide range of form, fit and function designs and beautiful appearance prototypes.
Read More »
New Thermal Gel from Henkel Offers Stable Viscosity in Storage and in Use
Accommodates gaps up to 3.0 mm. and provides production simplicity as pre-cured formulation requires no mixing or refrigeration. Features vertical gap stability with no slipping during more than 1,000 hours of gap stability testing. Can withstand environmental and positioning demands of infrastructure components.
Read More »
New microTIM Micro-Thermal Interface Coatings Reduce Heat Per Pluggable Optical Module (POM)
Facilitate greater heat dissipation from the module, reducing operational temperature at a rate of 0.33° C per watt. Resistant to salt corrosion, abrasion and vibration, and are compatible with service temperatures from -40° C to +200° C. Offers transition to 400 Gb modules, the power level per POM can reach as high as 15 watts.
Read More »
Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...
Read More »
New Henkel Underfill Operates at High Temperatures For use in Aero and Auto Electronics
Henkel's new under-fill Loctite Eccobond UF 1173 operates at high temperatures of 155 degrees C. Applications include use in driver assistance systems with products such as cameras, and radars in both the automotive and aerospace industries.
Read More »
Peelable Thermal Interface Material (TIM) from Henkel Recognized with Industry Accolade
Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material Irvine, CA – Notching its second notable industry prize, Henkel’s BERGQUIST® Gap Filler TGF 1500RW liquid thermal interface material recently took top honors in the Global Technology Awards’ adhesives/coatings/encapsulants/TIMs category. The award contest, which is sponsored by Global SMT and Packaging...
Read More »
New Thermally Conductive Laminate from Henkel Provides a Higher Standoff
Henkel has released a new version of their BERGQUIST® BONDPLY® LMS-HD thermally conductive laminate material. The material has an increased thickness and is capable of providing a higher standoff between the device and heat sink for reinforced insulation. The material is a heat-curable formulation which offers a thermal performance of 1.4 W/m-K and strong adhesion. It complies with the...
Read More »
New LOCTITE ABLESTIK CF 3366 Assembly Film Offers Void-Free Bondline with Controlled Thickness
The LOCTITE® ABLESTIK® CF 3366 Assembly Film maintains adhesion strength up to temperatures as high as 175°C and has a curing capability at temperatures as low as 125°C. The product is suitable for aircraft, unmanned aerial vehicles (UAVs), communications and cybersecurity infrastructure applications. The film can be cut into complex shapes and patterns to accommodate any assembly dimensions....
Read More »
Henkel Highlights Thermal Management Solutions at the Battery Show North America 2018
BERGQUIST® Brand Liquid and Pad Thermal Interface Materials Improve Performance, Lifetime and Reliability of Li-Ion Automotive Battery Systems Irvine, CA – Henkel’s BERGQUIST® brand of thermal management materials is the market leader in versatile, reliable and cost-effective heat dissipation solutions across nearly all electronic market segments. In the automotive space, specifically...
Read More »