Pixus Technologies
Waterloo, ON N2V1C5 CAN
Conduction-Cooled ATR Chassis meet military standards.
Available in ATR format or in specialty Small Form Factor designs, Conduction-Cooled Chassis support both OpenVPX and MicroTCA architectures. Units come in standard Ã-½ and Ã-¾ sizes for 3U or 6U boards. There are also options for MicroTCA.3 Hardened form factor as well as heat exchanged versions.Ã- Enclosures are designed to meet MIL-STD-704, MIL-STD-810G, and MIL-STD-461. For...
Read More »ATR Format Enclosures have conduction-cooled design.
Available for both OpenVPX and MicroTCA architectures, conduction-cooledÃ- ATR format chassis comes in Ã-½ andÃ- Ã-¾ sizes for 3U or 6U boards. Options are also available for MicroTCA.3 Hardened form factor as well as heat exchanged versions. Designed to meet MIL-STD-704, MIL-STD-810G, and MIL-STD-461, products are also available with power interface boards forÃ- incorporating...
Read More »Pixus Technologies Announces New Overview Brochures
Pixus Technologies, a provider of embedded computing and enclosure solutions, has released a new overview brochure that highlights the companies capabilities and core product lines. The new Pixus overview brochure features a brief history of the company, details on the 4 main product lines, and notes on it's customization, ruggedization, and simulation/analysis capabilities. The main product...
Read More »Conduction-Cooled ATR Chassis meet military standards.
Available in ATR format or in specialty Small Form Factor designs, Conduction-Cooled Chassis support both OpenVPX and MicroTCA architectures. Units come in standard Ã-½ and Ã-¾ sizes for 3U or 6U boards. There are also options for MicroTCA.3 Hardened form factor as well as heat exchanged versions.Ã- Enclosures are designed to meet MIL-STD-704, MIL-STD-810G, and MIL-STD-461. For...
Read More »ATR Format Enclosures have conduction-cooled design.
Available for both OpenVPX and MicroTCA architectures, conduction-cooledÃ- ATR format chassis comes in Ã-½ andÃ- Ã-¾ sizes for 3U or 6U boards. Options are also available for MicroTCA.3 Hardened form factor as well as heat exchanged versions. Designed to meet MIL-STD-704, MIL-STD-810G, and MIL-STD-461, products are also available with power interface boards forÃ- incorporating...
Read More »New Web Site from Pixus Technologies Features A Different Kind of Electronic Packaging Solutions Company
Pixus Technologies, a provider of embedded computing and enclosure solutions, has revamped its Web site and product offering. Pixus has re-organized the www.pixustechnologies.com Web site into two business units Rackmount Rugged Solutions and Cases, Subracks, and Rittal Brand Components.Ã- The former division includes backplanes and chassis platforms in multiple architectures, including...
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