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Operated in -50°C to +200°C temperature range, HTSX Silicone Thermal Interface Material offers thermal conductivity of 1.58 W/mK (guarded hot plate) and 1.05 W/mK (heat flow). Used as heatsinks or as thermal gap filler for dissipating heat between electronic devices, HTSX is offered in 35 ml syringe and 830 g cartridge.Read More
Available in TPM350 and TPM550 models, Phase Change Materials enhance performance with thermal shock and can operate in -40 to +125˚C temperature range. Minimizing contact thermal resistance, TPM350 has thermal conductivity of 3.5W/m.K at 50°C temperature. Featuring thixotropic characteristics, TPM550 has thermal conductivity of 5.5W/m.K with 45˚C activation temperature. TPM350 and TPM550... Read More