Adeka Corporation

Chemicals & Gases

ADEKA to Join Plastindia 2015 Trade Show in India

TOKYO –Â- ADEKA Corporation, a Japan-based leading polymer additives manufacturer, announced Jan. 8 it will showcase its strong line-up of Polymer Additives at Plastindia 2015 plastics and rubber trade show in Ghandinagar, Gujarat, India in February. Plastindia 2015 (http://www.plastindia.org/) • Date: Feb. 5 Thu. to Feb. 10 Tue., 2015 • Place: Mahatma Mandir Convention and Exhibition...

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Materials

ADEKA to Join 3 International Conferences in October

TOKYO - ADEKA Corporation, a polymer additives manufacturer based in Japan, announced on September 16 that it will attend the following three international polymer additives conferences in October: - 16th annual SPE Conference 2014 on October 5 - 8 in Detroit, Michigan, U.S.A. - Vinyltech 2014 on October 20 - 22 in Indianapolis, Indiana, U.S.A. - Polyolefin Additives 2014 on October 28 - 30 in...

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Chemicals & Gases

ADEKA Group to Join Interplastica 2014 Trade Fair

TOKYO - ADEKA Palmarole SAS, the French subsidiary of ADEKA Corporation, will join the International Trade Fair Plastics and Rubber (Interplastica 2014), a plastics and rubber industry fair to be held at the Expocentre in Moscow, Russia. The fair takes place on Jan. 28-31, 2014, and ADEKA will exhibit its products at Hall 8.1, Booth 8.1.B35. Interplastica, which will be held for the 17th time, is...

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Materials

Additive for Copper Plating is suited for TSV filling.

Single-component type additive for TSV (Through Silicone Via) copper plating aids semiconductor manufacturers stacking multiple chips into 3D structure. Bottom-up filling (copper deposition progress from bottom of via) avoids occurrence of defects in filled copper. Effective with TSVs of various sizes, additive is also effective with via holes of different sizes on same wafer. Perfect filling has...

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Machinery & Machining Tools

ADEKA to Attend Three Conferences and Have Stand at K Trade Fair

TOKYOÂ- – ADEKA Corporation (http://www.adeka.co.jp/en/chemical/index.html), a leading  manufacturer of a wide range of excellent polymer additives that provide plastics with amazing performance, will attend three conferences, Polyolefin Additives 2013 in September, SPE (R) TPO Automotive Engineered Polyolefins Conference and ABC 2013 (Annual Blow Molding Conference), both in...

Read More »
Chemicals & Gases

ADEKA to Join Plastindia 2015 Trade Show in India

TOKYO –Â- ADEKA Corporation, a Japan-based leading polymer additives manufacturer, announced Jan. 8 it will showcase its strong line-up of Polymer Additives at Plastindia 2015 plastics and rubber trade show in Ghandinagar, Gujarat, India in February. Plastindia 2015 (http://www.plastindia.org/) • Date: Feb. 5 Thu. to Feb. 10 Tue., 2015 • Place: Mahatma Mandir Convention and Exhibition...

Read More »
Materials

ADEKA to Join 3 International Conferences in October

TOKYO - ADEKA Corporation, a polymer additives manufacturer based in Japan, announced on September 16 that it will attend the following three international polymer additives conferences in October: - 16th annual SPE Conference 2014 on October 5 - 8 in Detroit, Michigan, U.S.A. - Vinyltech 2014 on October 20 - 22 in Indianapolis, Indiana, U.S.A. - Polyolefin Additives 2014 on October 28 - 30 in...

Read More »
Chemicals & Gases

ADEKA Group to Join Interplastica 2014 Trade Fair

TOKYO - ADEKA Palmarole SAS, the French subsidiary of ADEKA Corporation, will join the International Trade Fair Plastics and Rubber (Interplastica 2014), a plastics and rubber industry fair to be held at the Expocentre in Moscow, Russia. The fair takes place on Jan. 28-31, 2014, and ADEKA will exhibit its products at Hall 8.1, Booth 8.1.B35. Interplastica, which will be held for the 17th time, is...

Read More »
Materials

Additive for Copper Plating is suited for TSV filling.

Single-component type additive for TSV (Through Silicone Via) copper plating aids semiconductor manufacturers stacking multiple chips into 3D structure. Bottom-up filling (copper deposition progress from bottom of via) avoids occurrence of defects in filled copper. Effective with TSVs of various sizes, additive is also effective with via holes of different sizes on same wafer. Perfect filling has...

Read More »
Machinery & Machining Tools

ADEKA to Attend Three Conferences and Have Stand at K Trade Fair

TOKYOÂ- – ADEKA Corporation (http://www.adeka.co.jp/en/chemical/index.html), a leading  manufacturer of a wide range of excellent polymer additives that provide plastics with amazing performance, will attend three conferences, Polyolefin Additives 2013 in September, SPE (R) TPO Automotive Engineered Polyolefins Conference and ABC 2013 (Annual Blow Molding Conference), both in...

Read More »

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